Shared Transceiver Cooling Layout for Dense High-Power Modules

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Solution Overview

Problem

Conventional heat dissipation devices for transceiver devices in networking systems are inadequate in managing the high heat generated by high-power transceiver devices, especially when multiple devices are in close proximity, leading to inefficiencies and potential failure.

Innovation Solution

A multiple transceiver heat dissipation device that thermally couples to each transceiver device and dissipates heat using a heat dissipation element, distributing and radiating heat across a larger volume to balance thermal loads and enhance cooling capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If dedicated heat dissipation devices are provided for each transceiver device, then heat dissipation capability is improved, but device complexity and space requirements increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple dedicated heat dissipation devices into a single shared heat dissipation device that serves multiple transceiver devices simultaneously. This merging approach maintains adequate heat dissipation capability while reducing overall device complexity and saving space within the networking device housing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shared heat dissipation device is designed to perform multiple functions by dissipating heat from multiple different transceiver devices. This universal heat dissipation approach eliminates the need for separate dedicated devices for each transceiver, thereby reducing device complexity while maintaining thermal management effectiveness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If multiple transceiver devices are configured in close proximity, then networking functionality is improved, but heat accumulation and thermal management become problematic

Engineering Contradiction:

Improvenetworking functionalityVSAvoidheat accumulation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent merges the heat dissipation resources of multiple transceiver devices into a shared heat dissipation device. This allows transceiver devices to be configured in close proximity for improved networking functionality while the shared heat dissipation device collectively manages the thermal load from all devices, preventing heat accumulation.

Inventive Principle:

Principle #5Merging (Combining)

3Power

If high-power transceiver devices are used, then data transmission capability is improved, but heat generation exceeds dissipation capabilities

Engineering Contradiction:

Improvedata transmission capabilityVSAvoidheat generation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent implements a shared heat dissipation device that aggregates the thermal management capacity needed for multiple high-power transceiver devices. This merging of heat dissipation resources provides sufficient total dissipation capability to handle the combined heat generation from high-power devices, enabling them to operate at full transmission capability without thermal limitations.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced cooling capacity, reducing the need for additional cooling systems, saving power, and allowing transceiver devices to operate at higher performance levels and for extended periods.

Implementation Method 1

a multiple transceiver heat dissipation device that is thermally coupled to each of the plurality of transceiver devices and that is configured to: receive heat generated by each of the plurality of transceiver devices; transfer the heat to a heat dissipation element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

dissipate, using the heat dissipation element, the heat

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

distributing and radiating heat across a larger volume to balance thermal loads and enhance cooling capacity

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS12489472B2Multiple transceiver cooling system

Publication Date: 2025.12.02 DELL PROD LP

AI summary

A multiple transceiver cooling system includes a networking device, a plurality of transceiver device chassis that are included in the networking device, that are positioned adjacent each other, and that are each configured to receive a respective transceiver device, and a multiple transceiver heat dissipation device that engages each of the plurality of transceiver device chassis. With the multiple transceiver heat dissipation device engaging each of the plurality of transceiver device chassis, the multiple transceiver heat dissipation device may receive heat generated by respective transceiver devices located in the plurality of transceiver device chassis, transfer the heat to a heat dissipation element, and dissipate the heat using the heat dissipation element.