Shared Temperature Trim Interpolation for Multiple IC References

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Solution Overview

Problem

Conventional techniques for temperature compensation in integrated circuits (ICs) require significant resources and area due to the use of multiple interpolator circuits and local latches for each reference circuit, which can occupy a substantial portion of the IC's space and power.

Innovation Solution

A temperature trim architecture that uses a serially connected string of primary latch circuits, a single multiplexer, and a single interpolator to generate individualized temperature trim codes for multiple reference circuits, reducing the overall IC area and power consumption while maintaining performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional techniques use multiple interpolator circuits and local latches for each reference circuit, then temperature compensation accuracy is maintained, but IC area and power consumption increase significantly

Engineering Contradiction:
Improvetemperature compensation accuracyVSAvoidIC area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent merges multiple interpolator circuits and local latches into a single shared interpolator and latch structure. The interpolator receives temperature data and generates trim codes that are distributed to multiple reference circuits through a multiplexer, eliminating the need for separate interpolators at each reference circuit location while maintaining temperature compensation accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single interpolator circuit serves multiple reference circuits simultaneously by generating temperature compensation trim codes that are applicable to different reference voltage circuits. The multiplexer distributes these universal trim codes to the appropriate reference circuits based on temperature conditions, allowing one interpolator to perform the function of multiple interpolators.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If conventional techniques use multiple interpolator circuits and local latches for each reference circuit, then temperature compensation is provided, but power consumption increases

Engineering Contradiction:
Improvetemperature compensationVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent combines multiple power-consuming interpolator circuits into a single shared interpolator that serves all reference circuits. By eliminating redundant circuitry, the total power consumption is reduced while the temperature compensation function remains intact through the shared interpolator and multiplexer distribution system.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the interpolator function from each individual reference circuit and consolidates it into a single centralized interpolator. This extraction removes unnecessary duplication of functional blocks, reducing overall power consumption while preserving the essential temperature compensation capability through the shared resource architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

3Measurement precision

If conventional techniques are used for temperature compensation, then reference circuit accuracy is maintained, but device complexity increases

Engineering Contradiction:
Improvereference circuit accuracyVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple independent temperature compensation circuits into a single integrated system comprising one interpolator, one multiplexer, and shared latches. This consolidation simplifies the overall device architecture by reducing the number of independent circuit blocks while maintaining reference circuit accuracy through the coordinated operation of the shared components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The multiplexer serves as a universal distribution component that routes temperature trim codes from the single interpolator to multiple reference circuits based on temperature conditions. This universal component replaces multiple dedicated circuits, reducing device complexity while ensuring each reference circuit receives appropriate temperature compensation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11714443B2Temperature interpolation techniques for multiple integrated circuit references
Publication Date: 2023.08.01 MICRON TECHNOLOGY INC
  • US11714443B2 patent drawing
  • US11714443B2 patent drawing
  • US11714443B2 patent drawing

AI summary

Techniques for providing temperature trim codes to multiple reference circuits of an integrated circuit are provided. In an example, a string of primary latch circuits can provide a set of pre-defined temperature trim codes to a multiplexer in response to a token of a series of tokens. The multiplexer can provide two trim of the trim codes to an interpolator based on a temperature reading of the integrated circuit. The interpolator can provide an interpolated trim code and the trim code can be distributed to a reference circuit based on the token.