Shared Temperature Trim Interpolation for Multiple IC References

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Solution Overview

Problem

Conventional techniques for temperature compensation in integrated circuits (ICs) require significant resources and area due to the use of multiple interpolator circuits and local latches for each reference circuit, which can occupy a substantial amount of space on the IC.

Innovation Solution

A temperature trim architecture that uses a serially connected string of primary latch circuits, a single multiplexer, and a single interpolator to generate individual temperature trim codes for multiple reference circuits, reducing the overall IC area and power consumption while maintaining performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional techniques use multiple interpolator circuits and local latches for each reference circuit, then temperature compensation accuracy is maintained, but IC area occupied increases significantly

Engineering Contradiction:
Improvetemperature compensation accuracyVSAvoidIC area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent merges multiple interpolator circuits and local latches into a single shared interpolator and latch structure. The temperature sensor output is fed to a common interpolator that generates trim codes for multiple reference circuits, eliminating the need for separate interpolators and latches at each reference circuit location while maintaining temperature compensation accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a universal interpolator circuit that serves multiple reference circuits simultaneously. This single interpolator circuit performs the function of what would traditionally require multiple separate interpolators, and the latch structure is designed to distribute trim codes to multiple reference circuits, making the circuit multi-functional and area-efficient.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If conventional techniques employ multiple interpolator circuits and local latches, then individual temperature trim codes are provided to each reference circuit, but power consumption increases

Engineering Contradiction:
Improvetemperature trim code accuracyVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by stationary object

Solution Approach 1:

The patent combines multiple power-consuming interpolator circuits and latches into a single shared structure. By having one interpolator circuit serve multiple reference circuits instead of each circuit having its own interpolator, the overall power consumption is reduced while the accuracy of temperature trim codes provided to each reference circuit is maintained.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional techniques use separate interpolator circuits for each reference circuit, then temperature compensation is achieved, but device complexity increases

Engineering Contradiction:
Improvetemperature compensation reliabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the temperature compensation functionality into a single shared circuit structure rather than having separate circuits for each reference circuit. This reduces device complexity by eliminating redundant components while maintaining reliability through the universal design that can serve multiple reference circuits with the same temperature compensation accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a universal temperature compensation circuit that can serve multiple reference circuits simultaneously. This multi-functional design reduces overall circuit complexity while maintaining the reliability needed for accurate temperature compensation across all reference circuits in the integrated circuit.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11243554B1Temperature interpolation techniques for multiple integrated circuit references
Publication Date: 2022.02.08 MICRON TECHNOLOGY INC
  • US11243554B1 patent drawing
  • US11243554B1 patent drawing
  • US11243554B1 patent drawing

AI summary

Techniques for providing temperature trim codes to multiple reference circuits of an integrated circuit are provided. In an example, a string of primary latch circuits can provide a set of pre-defined temperature trim codes to a multiplexer in response to a token of a series of tokens. The multiplexer can provide two trim of the trim codes to an interpolator based on a temperature reading of the integrated circuit. The interpolator can provide an interpolated trim code and the trim code can be distributed to a reference circuit based on the token.