Shared Wafer-Level Optics for Compact AR/VR Camera and Projector Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The narrow frame of augmented reality (AR) and virtual reality (VR) headsets poses a design challenge for accommodating multiple devices, as real estate on the glasses frame is limited, making it difficult to mount projectors and cameras effectively.
Innovation Solution
The use of shared wafer-level optics, where optical elements such as microlenses for projectors and cameras are fabricated on the same transparent wafer, allowing for compact integration and co-location of these components on the headset, along with a transparent waveguide that channels light without obstructing the user's vision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple devices (projectors and cameras) are mounted on the headset frame, then the functionality of the AR/VR headset is improved, but the device complexity and space requirements increase
Solution Approach 1:
The patent combines multiple optical devices (projector and camera) into a single integrated optics module. The projector and camera share common optical elements including microlenses, waveguides, and structural components fabricated on the same wafer, reducing the number of separate devices and simplifying the overall system architecture.
Solution Approach 2:
The integrated optics module serves multiple functions simultaneously - it acts as both a projector for displaying information and a camera for capturing images. The shared optical path and common wafer-fabricated elements enable the system to perform multiple operations through a single unified structure.
2Adaptability or versatility
If multiple devices are mounted on the headset frame, then the functionality is improved, but the area available for mounting is insufficient
Solution Approach 1:
The projector and camera are merged into a single compact optics module that occupies minimal space on the headset frame. By integrating both devices and sharing common components, the mounting footprint is dramatically reduced compared to separate device arrangements.
Solution Approach 2:
The camera is positioned within the optical path of the projector, with the camera lens nested within the projector's optical structure. This nested arrangement allows both devices to coexist in a compact configuration, maximizing space utilization on the limited headset frame area.
3Ease of manufacture
If optical elements are fabricated separately for projector and camera, then the manufacturing process is simpler, but the device complexity and space requirements increase
Solution Approach 1:
Optical elements for both the projector and camera are merged into a single wafer-fabricated structure. Microlenses, waveguides, and other optical components are created simultaneously on the same wafer using integrated manufacturing processes, reducing the number of separate fabrication steps and assembly operations.
Solution Approach 2:
The patent replaces traditional mechanical assembly of separate optical components with a wafer-level integration process. Optical elements are fabricated directly onto a substrate using semiconductor manufacturing techniques, eliminating the need for complex mechanical mounting and alignment procedures.
4Ease of manufacture
If traditional separate mounting of projectors and cameras is used, then the manufacturing is simpler, but the headset becomes bulkier and heavier
Solution Approach 1:
The projector and camera are combined into a single lightweight optics module with shared components and common structural elements. This integration eliminates redundant materials and reduces the overall mass compared to mounting separate projector and camera devices on the headset.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact and efficient optics module that can be inserted into the light path of both the projector and camera, providing a lightweight and less bulky option for AR/VR headsets while maintaining effective light guidance and display functionality.
Implementation Method 1
a transparent waveguide that channels light without obstructing the user's vision
Implementation Method 2
optical elements, e.g., microlenses, of a projector are fabricated on the same wafer as optical elements, e.g., microlenses, of a camera
Data Source
AI summary
Various configurations of projectors and cameras are disclosed that use shared wafer level optics, in which optical elements, e.g., microlenses, of a projector are fabricated on the same wafer as optical elements, e.g., microlenses, of a camera. Projectors and cameras can be mounted together on a mixed reality headset, e.g., an AR/VR headset, for example, as a feature of smart glasses. Some projectors and/or cameras can be co-located in the arm or temple of the glasses. Some projectors and/or cameras can be co-located near a center point of the frame of the glasses. Use of shared wafer-level optics provides a compact and efficient solution for simultaneously guiding light leaving a projector and light entering a camera.