Shearable Circuit Layer for Compliant Wearable Patches
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Solution Overview
Problem
Conventional wearable patches face issues with comfort, breathability, durability, and aesthetic appeal due to rigid substrates that do not conform well to curved surfaces, leading to discomfort, irritation, and delamination during body movements.
Innovation Solution
The development of highly compliant and flexible wearable patches with a shearable circuit layer, an elastic layer, and a breathable adhesive layer that can elongate and conform to skin movements, incorporating semiconductor chips for wireless communication using NFC, Wi-Fi, or Bluetooth standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid polymer substrate is used in conventional wearable patches, then structural support and circuit stability are improved, but breathability and comfort are worsened due to sweat and moisture buildup
Solution Approach 1:
The patent employs a porous polymer substrate with controlled porosity (30-70% open cell structure) that allows sweat and moisture to pass through while maintaining structural support. The porous structure provides mechanical strength through the polymer matrix while the void spaces enable breathability and moisture wicking, resolving the contradiction between structural support and comfort.
Solution Approach 2:
The patent uses composite material structures combining rigid polymer substrates with flexible adhesive layers and breathable cover layers. This multi-layer composite approach allows each layer to perform its specialized function - the substrate provides structural support, while the adhesive and cover layers provide breathability and comfort, collectively resolving the contradiction.
2Stability of the object's composition
If a rigid polymer substrate is used in conventional wearable patches, then structural stability is improved, but conformability to curved surfaces is worsened
Solution Approach 1:
The patent segments the wearable patch into multiple independent layers (substrate layer, adhesive layer, cover layer, circuit layer) that can move and deform independently. This segmentation allows the overall structure to conform to curved surfaces while each individual layer maintains its structural stability, resolving the contradiction between structural stability and conformability.
Solution Approach 2:
The patent incorporates dynamic elements including flexible adhesive layers that can deform with skin movements and elastic modulus gradients within the substrate that provide both rigidity for stability and flexibility for conformability. The adhesive layer acts as a buffer that dynamically adapts to surface curvature changes while the substrate maintains structural integrity.
3Adaptability or versatility
If conventional wearable patches undergo repeated elongations during body movements, then adaptability to body motion is improved, but durability is worsened due to layer breakage and delamination
Solution Approach 1:
The patent incorporates pre-designed stress relief features including cutouts, notches, and flexible adhesive layers that act as cushioning elements before stress causes damage. These features are built into the structure beforehand to absorb and distribute mechanical stresses from body movements, preventing layer delamination and circuit breakage, thus resolving the contradiction between adaptability and durability.
Solution Approach 2:
The patent uses flexible thin film structures for the adhesive layer and cover layer that can stretch and deform with body movements without breaking. These flexible films are designed with appropriate thickness and material properties to accommodate repeated elongation while maintaining integrity, resolving the contradiction between adaptability to motion and durability.
4Adaptability or versatility
If the adhesive layer is made highly compliant to conform to skin movements, then comfort and conformability are improved, but support for electronic components is worsened
Solution Approach 1:
The patent segments the adhesive layer into regions of different compliance - highly compliant areas for comfort and conformability, and reinforced areas with higher structural support for electronic components. This spatial segmentation allows the adhesive layer to simultaneously provide both soft conformability for skin contact and structural support for circuits, resolving the contradiction.
Solution Approach 2:
The patent applies local quality variations within the adhesive layer, using different adhesive formulations, thicknesses, or reinforcement structures in different regions. Areas beneath electronic components have enhanced structural properties while peripheral areas maintain high compliance for skin conformability, resolving the contradiction between comfort and component support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides durable, comfortable, and aesthetically appealing wearable patches that maintain constant contact with the skin, reduce irritation, and enhance breathability, while supporting electronic components and withstanding repeated elongations and compressions.
Implementation Method 1
an elastic layer on the shearable circuit layer... The disclosed wearable patches can change their physical shape and dimension to relieve stresses such as repeated elongations
Implementation Method 2
a shearable circuit layer... allow the shearable circuit layer to be sheared and elongated
Implementation Method 3
a support substrate comprising one or more openings on the adhesive layer... breathable
Data Source
AI summary
A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.