Multi-Plane Sheath Heater Stage for Uniform Substrate Heating
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Solution Overview
Problem
Existing substrate heating stages in semiconductor manufacturing face challenges in precise temperature control and uniform heating, particularly due to limitations in the arrangement of sheath heaters, which can lead to temperature variations and overheating issues.
Innovation Solution
A stage design featuring a first and second supporting plate with a sheath heater extending on parallel planes, allowing the upper and lower sections to overlap and be exposed from different surfaces, enabling more flexible and uniform heating by arranging multiple sheath heaters with terminals positioned strategically to prevent localized overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional sheath heater arrangement is used, then the heating function is provided, but temperature uniformity deteriorates and localized overheating occurs
Solution Approach 1:
The patent applies dimensionality change by arranging sheath heaters on multiple parallel planes (first plane and second plane) instead of a single plane. The sheath heater extends through the second supporting plate with its upper section on the first plane and lower section on the second plane, creating a three-dimensional heating distribution that eliminates localized overheating and improves temperature uniformity across the substrate.
2Area of stationary object
If multiple sheath heaters are arranged closely, then heating coverage is improved, but localized overheating worsens
Solution Approach 1:
The patent resolves this contradiction by distributing sheath heaters across multiple parallel planes at different distances from the first supporting plate. This vertical distribution allows heaters to be positioned both close to and far from the substrate, providing comprehensive heating coverage while preventing concentration of heat in any single location.
Solution Approach 2:
The patent applies local quality by varying the positions of different sheath heaters in the vertical direction. Some sheath heaters have their upper sections closer to the substrate while others are farther away, creating localized heating zones that collectively provide uniform overall heating without concentrated overheating spots.
3Ease of manufacture
If sheath heater terminals are positioned at the stage center, then electrical connection is simplified, but localized overheating at the center occurs
Solution Approach 1:
The patent applies local quality by strategically positioning sheath heater terminals at different locations (center, peripheral, or intermediate positions) depending on the specific heater's function and location. This allows electrical connections to be made at optimal points for each heater while distributing heat generation away from the center, preventing localized overheating at the stage center.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise control of substrate temperature and uniform heating, enabling the precise patterning of semiconductor films while preventing overheating at the stage center, thus improving the reliability and efficiency of semiconductor manufacturing processes.
Implementation Method 1
A sheath heater is frequently used as a heater for heating the stage
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
Disclosed is a stage including a first supporting plate, a second supporting plate under the first supporting plate, a shaft under the second supporting plate and overlapping with the first supporting plate and the second supporting plate, and at least one sheath heater passing through the second supporting plate. The at least one sheath heater is arranged so as to extend on a first surface and a second surface which are parallel to an upper surface of the second supporting plate and which are different in distance from the first supporting plate from each other.