Sheathed Wire Chip Element Handling
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Solution Overview
Problem
Miniaturized microelectronic chip elements, such as those used in RFID devices, pose handling challenges due to their small size and the need to maintain straight dipole antennas to prevent short-circuiting, which is not effectively addressed by existing manufacturing and handling methods.
Innovation Solution
A method of packaging these chip elements by incorporating them into a wrapped wire with a core and helically wound sheathing fiber, where the chip elements are caught between the core and the fiber, and sections of wire, including dipole antennas, are integrated between the core and the sheathing fiber to maintain alignment and prevent twisting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If chip elements are handled individually using conventional methods, then manufacturing flexibility is maintained, but handling difficulty increases and risk of antenna twisting rises
Solution Approach 1:
The patent embeds multiple chip elements within a continuous wrapped wire structure, where each chip is nested between the core wire and the sheathing fiber. This nesting approach allows individual chip handling while maintaining antenna alignment, as the sheathing fiber prevents twisting during manipulation and integration processes.
Solution Approach 2:
The wrapped wire structure acts as an intermediary carrier between the chip elements and the final integration target. The sheathing fiber specifically serves as a protective intermediary that maintains antenna geometry during handling, transferring chips to their destination without direct manual manipulation that could cause twisting.
2Volume of moving object
If chip elements are miniaturized to reduce device size, then device compactness improves, but handling precision requirements increase
Solution Approach 1:
The patent embeds multiple chip elements within a continuous wrapped wire structure, where each chip is nested between the core wire and the sheathing fiber. This nesting approach allows individual chip handling while maintaining antenna alignment, as the sheathing fiber prevents twisting during manipulation and integration processes.
Solution Approach 2:
The sheathing fiber acts as a flexible protective shell that envelops the chip elements and their antenna structures. This flexible enclosure maintains the geometric integrity of miniaturized chips during handling without requiring rigid constraints that would complicate the structure or reduce flexibility during integration.
3Reliability
If dipole antennas are kept straight to prevent short-circuiting, then electrical reliability improves, but handling complexity increases
Solution Approach 1:
The wrapped wire structure acts as an intermediary carrier between the chip elements and the final integration target. The sheathing fiber specifically serves as a protective intermediary that maintains antenna geometry during handling, transferring chips to their destination without direct manual manipulation that could cause twisting.
Solution Approach 2:
The sheathing fiber acts as a flexible protective shell that envelops the chip elements and their antenna structures. This flexible enclosure maintains the geometric integrity of miniaturized chips during handling without requiring rigid constraints that would complicate the structure or reduce flexibility during integration.
Data Source
Figure 1~3
Figure 4A~6
AI summary
A method for producing a sheathed wire comprises the following steps: axially advancing a core (20) through a sheathing zone (32); wrapping a sheathing fiber (24) around the core in the sheathing zone; and providing a series of microelectronic chip elements (10), each of which has a wire section (12), in the sheathing zone (32) in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire which includes spaced-apart chip elements.