Sheet-like Adhesive for Organic EL Panel Assembly
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Solution Overview
Problem
Conventional sheet-like adhesives have low adhesion to electronic parts, require high-temperature curing, and exhibit poor flowability, leading to potential damage and bubble formation on uneven surfaces during the assembly of organic EL panels.
Innovation Solution
A heat-curable sheet-like adhesive comprising a film forming component with an epoxy equivalent of 7000 to 20000 g/eq, an epoxy resin with 0 to 20% solid content, and an encapsulated epoxy adduct-type latent curing agent, which allows for tack at 25°C and low-temperature curing between 70 to 100°C, enabling effective bonding and flowability without damaging the organic EL panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a conventional sheet-like adhesive is formed into the B-stage at about 100°C, then the adhesive reaches a partially cured state, but the adhesion to adherend becomes low and high-temperature heating is required for further curing
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive system by introducing a multi-component epoxy resin system with specific epoxy equivalents (7000-20000 g/eq for component A, 150-5000 g/eq for component B) and encapsulated latent curing agents. This parameter change enables the adhesive to achieve both B-stage stability and high adhesion at low temperatures, resolving the contradiction between curing state stability and adhesion strength.
2Stability of the object's composition
If a sheet-like adhesive in the B-stage is heated at high temperature for further curing, then the curing is promoted, but the adherend (electronic part) suffers damage due to high temperature
Solution Approach 1:
The patent modifies the curing system parameters by using encapsulated epoxy adduct-type latent curing agents that enable low-temperature curing (70-100°C). This parameter change allows the adhesive to progress through curing stages without requiring high temperatures, thus promoting curing while avoiding thermal damage to electronic components.
Solution Approach 2:
The encapsulated latent curing agent acts as an intermediary that mediates between the epoxy resin and the curing process. The encapsulation allows the curing agent to remain dormant during application and only activate at the specific low temperature range (70-100°C), enabling controlled curing progression without high temperature exposure to the adherend.
3Stability of the object's composition
If a sheet-like adhesive in the B-stage is heated, then the curing is accelerated, but the adhesive hardly exhibits flowability and bubbles remain on uneven adherend surfaces
Solution Approach 1:
The patent creates a dynamic curing process where the adhesive transitions from a flowable state at application temperature to a curing state at elevated temperature (70-100°C). The multi-component system with latent curing agents provides dynamic control over viscosity and flowability, allowing the adhesive to flow into uneven surfaces and displace bubbles during heating while simultaneously progressing through curing stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves strong adhesion, prevents bubble formation, and reduces the risk of dark spots and drive voltage variations, ensuring high-quality assembly of organic EL panels with improved storage stability and bond strength.
Implementation Method 1
a heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.
Implementation Method 2
The reason is that, when formed into a sheet-like shape, with temperature at about 100° C., a cured state reaches a stage of partially curing or in the course of full curing, so-called B-stage.
Implementation Method 3
which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.
Data Source
AI summary
A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.:the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B);the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); andthe component (C): an encapsulated epoxy adduct-type latent curing agent.