Sheet Contactor Socket Segmentation for Thin Package Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package inspection sockets face challenges in accurately positioning semiconductor packages due to limitations in guiding and supporting the contact terminals, leading to potential misalignment and increased thickness requirements, which can result in warpage and processing defects.
Innovation Solution
A sheet contactor socket design featuring a plate with guided placement portions and a cover that elastically supports the plate, utilizing through holes and guide portions to accurately position semiconductor packages without increasing thickness, ensuring proper contact between contact terminals and electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the plate is made thicker to provide sufficient guiding portion, then the guiding function is improved, but the overall thickness increases causing warpage and processing defects
Solution Approach 1:
The plate is divided into a placement portion with guiding portions and a non-placement portion without guiding portions. This segmentation allows the guiding function to be concentrated in specific areas rather than requiring the entire plate to be thick, thus achieving precise guiding while maintaining overall thinness and avoiding warpage.
2Manufacturing precision
If the placement portion area is increased to improve positioning, then the positioning accuracy is improved, but the non-placement area decreases limiting contact terminal access
Solution Approach 1:
The plate exhibits local quality by having guiding portions only in the placement portion area, while the non-placement portion remains without guiding portions. This allows the placement portion to provide accurate positioning where needed, while the non-placement portion maintains sufficient area for contact terminal access and electrical connection.
3Stability of the object's composition
If the plate is rigidly fixed to prevent movement, then the positional stability is improved, but the impact from dropped packages increases causing damage
Solution Approach 1:
The cover elastically supports the plate from below, providing beforehand cushioning against impact forces. When a semiconductor package is dropped onto the plate, the elastic support absorbs the shock, preventing damage to both the package and the plate while maintaining positional stability during normal operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables precise alignment of electrodes with contact terminals, reducing processing defects and maintaining thinness, allowing for high-frequency energization inspections while minimizing impact on the semiconductor package.
Implementation Method 1
a cover configured to elastically support the plate
Data Source
AI summary
A sheet contactor socket, includes: a plate positioned on an upper side of a sheet contactor having contact terminals and having an accommodation portion that is able to accommodate a semiconductor package having contact portions in contact with the contact terminals, respectively; and a cover elastically supports the plate. The accommodation portion includes: a placement portion on which the semiconductor package is able to be placed and that has a guiding portion that guides the contact portions to a position where the contact portions and the contact terminals are able to be brought into contact with each other; and a non-placement portion on which the semiconductor package is not placed. A placement region of the placement portion in the accommodation portion is smaller than a non-placement region of the non-placement portion on which the semiconductor package is not placed.