Sheet Heat Dissipation Member for Module Height Reduction
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Solution Overview
Problem
Existing modules with heat-generating components, such as semiconductor elements, face inadequate heat dissipation due to limited heat dissipation paths, leading to performance degradation and increased module thickness when traditional heat sinks are used, and reliability issues when thermally conductive sheets are employed without resin filling.
Innovation Solution
A module design incorporating a sheet-like heat dissipation member with both contact and non-contact portions that allows resin filling, forming part of the heat dissipation path to the wiring substrate, reducing module height and enhancing reliability by ensuring resin filling around components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation member such as a heat sink is disposed on the top surface of the semiconductor element, then heat dissipation performance is improved, but the thickness of the module increases
Solution Approach 1:
The heat dissipation member is designed as a sheet-like structure that extends in the planar direction rather than vertically, changing the heat dissipation approach from vertical (heat sink on top) to lateral (sheet extending around the component). This allows heat dissipation without increasing module thickness.
Solution Approach 2:
The sheet-like heat dissipation member is disposed to surround the semiconductor element, with portions in contact with the component and portions extending to the sealing resin layer. This nested configuration allows the heat dissipation member to be integrated within the module structure without adding external thickness.
2Length of stationary object
If a thermally conductive sheet is disposed on the heat generating component to prevent module thickness increase, then module height is reduced, but the resin of the sealing resin layer cannot be filled into the region around the component, degrading connection reliability
Solution Approach 1:
The sheet-like heat dissipation member is designed with a configuration that allows the sealing resin layer to be filled between the heat dissipation member and the semiconductor element. The heat dissipation member is disposed to surround the component rather than completely covering it, creating space for resin filling that enhances connection reliability.
Solution Approach 2:
The heat dissipation member has different portions with different functions: contact portions that touch the semiconductor element for heat conduction, and non-contact portions that extend to the sealing resin layer to allow resin filling. This local differentiation resolves the contradiction between heat dissipation and reliability.
3Device complexity
If only solder bumps are used as heat dissipation paths from the semiconductor element to the wiring substrate, then the structure is simple, but heat dissipation performance is insufficient
Solution Approach 1:
The invention combines multiple heat dissipation paths: the solder bumps that connect the semiconductor element to the wiring substrate, and the sheet-like heat dissipation member that provides additional thermal conduction pathways. This merging of heat dissipation routes improves overall heat dissipation performance without significantly increasing structural complexity.
Solution Approach 2:
The sheet-like heat dissipation member serves multiple functions: it acts as a thermal conduction path from the semiconductor element to the sealing resin layer, provides mechanical support, and allows the sealing resin to be filled for enhanced connection reliability. This multi-functionality improves heat dissipation without adding complex dedicated heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance by expanding heat dissipation paths and maintains component reliability by filling resin between the heat dissipation member and components, while minimizing module height compared to traditional heat sink designs.
Implementation Method 1
the heat dissipation member forms at least part of a heat dissipation path through which heat generated by the first component is transmitted to the wiring substrate
Implementation Method 2
a sealing resin layer configured to cover the first component and the major surface of the wiring substrate
Data Source
AI summary
A module that has excellent heat dissipation performance and enables height reduction easily is provided. The module includes a wiring substrate, a plurality of components mounted on the top surface of the wiring substrate, a plurality of heat dissipation members, a sealing resin layer laminated on the top surface of the wiring substrate, and a shield film that covers surfaces of the sealing resin layer. The heat dissipation member is formed into a strip-shaped sheet. In addition, both end portions of the heat dissipation member are in contact with the top surface of the wiring substrate and also with the components disposed between the both end portions. The heat dissipation member thereby forms a heat dissipation path that transmits heat generated by the component to the wiring substrate.