Sheet-Shaped Pin Assembly for Compact Inductor Power Modules
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Solution Overview
Problem
The increasing number of layers in server mainboards and the need for reduced power supply area occupancy pose challenges in signal and power transmission, particularly due to space limitations that restrict the size and placement of capacitors and inductors, affecting reliability and efficiency.
Innovation Solution
A method involving a copper layer with semi-etched glue grooves and a substrate layer forming pin assemblies, integrated with an inductor, where the pin assembly is adhered to the inductor's side surface and features coplanar terminal surfaces, along with a magnetically permeable core and windings, allowing for compact and precise pin placement and reduced parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pin assembly uses traditional pin header mode with pins attached to plastic body, then the welding reliability of signal pins is ensured, but the occupied area and height of the signal pin header increase
Solution Approach 1:
The patent transitions from a traditional three-dimensional pin header structure (pins attached to plastic body extending vertically) to a two-dimensional planar pin assembly structure (copper layers with etched grooves forming pins on a flat substrate). This dimensional reduction allows the pin assembly to be adhered flatly to the inductor surface, minimizing occupied area while maintaining all necessary pin functions for signal transmission and welding reliability.
Solution Approach 2:
The patent uses a thin substrate layer (e.g., 0.1-0.5mm) as the base for the pin assembly, replacing the bulky plastic body of traditional pin headers. This thin-film approach, combined with etched copper patterns, creates a flexible yet rigid enough structure that can be adhered directly to the inductor surface, reducing the overall height and occupied space while maintaining structural integrity for reliable welding.
2Area of stationary object
If the power module adopts stacking mode to reduce occupied area, then the space utilization is improved, but the transmission of signal and power must pass through the inductor body affecting reliability
Solution Approach 1:
The patent segments the pin assembly into distinct functional regions: power pins for current transmission and signal pins for control signals. By separating these functions spatially on the planar assembly and providing dedicated bonding pads on the inductor surface, the design enables independent optimization of power and signal paths, ensuring reliable transmission while maintaining compact stacking configuration.
Solution Approach 2:
The patent introduces bonding pads as intermediary elements on the inductor surface that facilitate direct electrical connection between the pin assembly and the inductor windings. These bonding pads act as mediators that enable reliable signal and power transmission through the inductor body without requiring external connections, thus maintaining transmission reliability while achieving compact stacking.
3Reliability
If the capacitor Cin1 is placed nearby the power semiconductor element, then the equivalent loop inductance is reduced, but the capacitance must be small due to space limitations requiring additional capacitors
Solution Approach 1:
The patent merges the decoupling capacitor function with the inductor structure by integrating the capacitor directly onto or into the inductor assembly. This consolidation eliminates the need for separate capacitor mounting space while maintaining the voltage spike suppression function, as the integrated capacitor remains electrically close to the power semiconductor element through the shared inductor structure.
Solution Approach 2:
The patent employs a nested configuration where the capacitor is placed within or alongside the inductor structure. This nesting approach allows the capacitor to be positioned in the space already occupied by the inductor assembly, effectively utilizing the three-dimensional space without increasing the overall footprint, thereby maintaining low loop inductance while saving board space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances pin assembly precision, improves welding quality, reduces magnetic loss, and minimizes parasitic inductance, resulting in a more reliable and efficient power module with improved space utilization and dynamic performance.
Implementation Method 1
adhering the pin assembly to a side surface of the inductor
Data Source
AI summary
A method includes disposing a substrate layer on a copper layer to form a pin assembly and adhering the pin assembly to a side surface of an inductor with bonding pads on either of the upper and lower surfaces, wherein welding surfaces are coplanarly aligned. An assembled magnetic apparatus including sheet-shaped pin assembly or pin assemblies and an inductor is thereby manufactured. A power module includes the magnetic apparatus, IPM units, a wiring board and output capacitors. The pin assembly may meet a PCB process specification for panel production, and the pin pitch is configured to be lessened.