Sheet-Resin Dosing for Semiconductor Compression Molding
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Solution Overview
Problem
Existing resin-sealing methods for semiconductor packages face challenges in supplying an appropriate amount of resin without redundancy or deficiency, leading to issues like resin burrs, uneven distribution, and dust formation, which affect molding quality and increase substrate costs.
Innovation Solution
A resin-sealing apparatus and method that uses a sheet-shaped resin supply part to cut and transport an exact amount of resin corresponding to the workpiece shape, eliminating redundancy and deficiency, and a transport part to deliver it to the sealing mold for compression molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If granular resin is used for compression molding, then resin can be supplied with no waste and no disposal costs, but the granules are likely to be unevenly sprinkled and difficult to thinly and evenly distribute
Solution Approach 1:
The invention changes the physical state of the resin from granular to sheet-shaped, and controls the thickness parameter of the sheet-shaped resin to match the cavity thickness. This parameter change enables the resin to be supplied as a unified sheet that can be evenly distributed without the uneven sprinkling problem of granular resin, while still achieving appropriate supply amount without waste
Solution Approach 2:
The invention segments the resin supply process into two independent stages: first supplying the sheet-shaped resin as a unified structure, then separating it into resin granules within the cavity during molding. This segmentation allows the resin to maintain uniform distribution as a sheet during supply, then transform into granules for proper molding filling
2Quantity of substance
If the amount of resin is reduced for thinner packages, then resin usage is optimized, but it becomes difficult to evenly sprinkle the resin with gaps between granules
Solution Approach 1:
The invention changes the resin form from discrete granules to a continuous sheet structure with controlled thickness. This parameter change allows the resin to be supplied in precise, thin quantities suitable for modern thin packages while maintaining uniform distribution through the sheet's continuous structure, eliminating the gaps and unevenness associated with granular supply
3Reliability
If resin is supplied with redundant amount to ensure adequate filling, then molding completeness is improved, but resin burrs form on the substrate side surface
Solution Approach 1:
The invention changes the resin supply method from excessive granular supply to precise sheet-shaped supply where the sheet thickness matches the cavity thickness. This parameter change enables complete mold filling while preventing resin overflow and burr formation on the substrate surface, as the resin is supplied in the exact quantity needed
4Ease of operation
If granular resin is vibrated and rubbed during supply, then resin separation is improved, but dust formation increases causing attachment and solidification on components
Solution Approach 1:
The invention performs preliminary separation of resin granules from the sheet-shaped resin within the cavity before the actual molding process. By pre-separating the granules in a controlled environment inside the mold, the need for external vibration and rubbing is eliminated, preventing dust generation from these mechanical actions while still achieving proper resin distribution
Data Source
AI summary
There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.