Sheet Separation Jig With Timed Support Blocks for Wafer Edge Pickup
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Solution Overview
Problem
Conventional semiconductor device pickup methods, such as those using needles or sliders, often result in cracking of thin semiconductor devices and complicate the apparatus design, increasing manufacturing costs and size when trying to pick up devices from the outer peripheral parts of wafers with zero waste.
Innovation Solution
A semiconductor manufacturing apparatus with a sheet separation jig featuring multiple support blocks and a single drive member that moves in a coordinated manner to lift the semiconductor device from the sheet, reducing the risk of cracking and simplifying the apparatus configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If needles are used to push up the semiconductor device from the adhesive sheet, then the pickup process is simple, but cracks occur in thin semiconductor devices (thickness of 100 μm or less)
Solution Approach 1:
The patent introduces a slider as an intermediary component between the needle and the semiconductor device. The slider moves in the lateral direction to push the device, mediating the force application to reduce direct needle contact and prevent cracking in thin devices while maintaining the pickup function.
Solution Approach 2:
The patent changes the method of force application by transitioning from direct vertical needle pushing to lateral slider movement. This parameter change in the direction and manner of force application reduces stress concentration on thin semiconductor devices, preventing cracks while achieving pickup.
2Ease of operation
If the dicing sheet is expanded to pick up semiconductor devices from the outer peripheral part of the wafer, then pickup property improves, but the slider may interfere with the inner wall of the cylindrical stage
Solution Approach 1:
The patent resolves the interference problem by changing the movement dimension of the slider. Instead of moving radially outward where it would collide with the cylindrical stage wall, the slider is configured to move in a direction that avoids the wall interference, enabling pickup of outer peripheral devices without structural complications.
3Adaptability or versatility
If the movement direction of the slider is reversed to pick up outer peripheral semiconductor devices, then pickup is enabled, but an arm rotational axis must be added, increasing apparatus size and manufacturing cost
Solution Approach 1:
Instead of reversing the slider movement direction which would require adding an arm rotational axis, the patent applies the inversion principle by configuring the slider to move in the original direction while adjusting the dicing sheet expansion and pickup mechanism to achieve outer peripheral device pickup without additional complex structures.
4Adaptability or versatility
If a support block is operated in the vertical direction to pick up outer peripheral semiconductor devices, then pickup is enabled, but a driving source must be provided for each support block, increasing apparatus size and manufacturing cost
Solution Approach 1:
The patent applies the merging principle by consolidating the driving function into a single drive mechanism that controls multiple support blocks. Instead of providing separate driving sources for each support block, the invention combines the driving function into one unit, reducing apparatus size and manufacturing cost while enabling pickup of outer peripheral semiconductor devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively picks up semiconductor devices from the outer peripheral parts of wafers with reduced cracking and simplifies the apparatus design, lowering manufacturing costs and improving yield by using a coordinated movement of support blocks to separate the device from the sheet.
Implementation Method 1
A first suction hole for sucking the rear surface of the sheet is formed in each of the plurality of support blocks
Data Source
AI summary
A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.