Sheet Shrinkage Heating for Slack-Free Chip Processing

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Solution Overview

Problem

Existing sheet processing methods face challenges in managing slack due to inconsistent material absorption of light, leading to increased complexity and cost in removing slack, and potential damage to chips during handling.

Innovation Solution

A method involving a light absorbing member that generates heat by absorbing light is used to shrink unfixed regions of the sheet, simplifying the process and reducing slack without the need for precise wavelength adjustments based on sheet material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the sheet material is changed to accommodate different processing needs, then the sheet can be adapted to various target objects and processing conditions, but the light absorption characteristics become inconsistent, requiring complex wavelength adjustments and increasing equipment complexity and cost

Engineering Contradiction:

Improvesheet material adaptabilityVSAvoidequipment complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A light absorbing member is introduced as an intermediary between the light source and the sheet. This member selectively absorbs light at specific wavelengths and converts it to heat, which then heats the sheet material uniformly. The light absorbing member acts as a mediator that decouples the light source from the sheet material properties, allowing consistent processing regardless of sheet material variations without requiring complex wavelength adjustments.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the direct optical heating method (where light directly heats the sheet) with a thermal conduction method (where light heats the light absorbing member, which then conducts heat to the sheet). This substitution of the heating mechanism simplifies the system by eliminating the need for precise wavelength control based on sheet material properties.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If direct light irradiation is used to heat and shrink the sheet, then precise wavelength control is required based on sheet material properties, but this increases equipment complexity and operational difficulty

Engineering Contradiction:

Improveheating precisionVSAvoidoperational simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The light absorbing member serves as an intermediary that receives light energy and converts it to thermal energy, which then transfers to the sheet material. This indirect heating method eliminates the need for operators to understand or control wavelength parameters based on sheet material properties, significantly simplifying operation while maintaining heating precision through controlled thermal conduction.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Force

If the sheet is stretched to apply external force for wafer division, then the division can be achieved, but slack occurs in the sheet after processing, causing handling difficulties and potential chip damage

Engineering Contradiction:

Improveexternal force applicationVSAvoidhandling ease

Core Design Contradiction:

ForceVSEase of operation

Solution Approach 1:

The patent utilizes thermal contraction (the reverse of thermal expansion) to shrink the sheet after it has been stretched during processing. By applying controlled heat through the light absorbing member to specific regions of the stretched sheet, the material contracts and removes slack, restoring proper tension and facilitating safe handling and transport of the divided wafers or chips.

Inventive Principle:

Principle #37Thermal expansion

Solution Approach 2:

The patent changes the temperature parameter of the sheet material to control its physical state. By heating the sheet through the light absorbing member, the material undergoes thermal contraction, changing from a stretched, slack state to a contracted, taut state. This parameter change allows the sheet to maintain proper tension after processing operations.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces or removes slack in the sheet, improving handling and reducing chip damage by uniformly heating and shrinking unfixed regions, thereby enhancing processing efficiency and reducing equipment complexity.

Implementation Method 1

bringing a light absorbing member configured to generate heat by absorbing light into contact with an unfixed region not fixed to the target object in the sheet, and heating and shrinking the unfixed region by making the light absorbing member generate heat through irradiation of the light absorbing member with the light

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

heating and shrinking the unfixed region by making the light absorbing member generate heat

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS20250299998A1Sheet processing method, chip manufacturing method, and substrate manufacturing method

Publication Date: 2025.09.25 DISCO CORP

AI summary

A sheet processing method for processing a sheet fixed to a target object includes preparing the target object to which the sheet is fixed, bringing a light absorbing member configured to generate heat by absorbing light into contact with an unfixed region not fixed to the target object in the sheet, and heating and shrinking the unfixed region by making the light absorbing member generate heat through irradiation of the light absorbing member with the light.