Sheet-Shaped Sinterable Bonding Material for Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding materials for semiconductor devices, particularly those with sinterability, face challenges in maintaining quality and reliability under high temperature conditions, leading to increased costs and inefficiencies due to non-uniform thickness, material waste, and potential damage to semiconductor elements during the bonding process.
Innovation Solution
A method involving a sheet-shaped bonding material with sinterability, containing Ag or Cu particles coated with an organic film, is applied to a substrate and semiconductor element, then sintered under pressure to ensure uniform bonding and reduce waste, enhancing the reliability and efficiency of the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If paste bonding material is screen-printed or applied with syringes, then bonding material can be disposed on substrate, but the bonding material does not have uniform thickness and irregularities are formed on surface
Solution Approach 1:
The patent uses a sheet-shaped bonding material instead of paste form. The sheet is flexible enough to conform to the substrate surface while maintaining uniform thickness, eliminating the irregularities caused by screen printing or syringe application methods.
Solution Approach 2:
The patent changes the physical form parameter of the bonding material from paste to sheet shape. This parameter change enables uniform thickness control while maintaining ease of application, directly resolving the contradiction between manufacturing ease and precision.
2Ease of operation
If bonding material is extruded from bonding surface, then pressure fails to be applied to part of bonding material during sintering, but sintered material may fall off after sintering
Solution Approach 1:
The sheet-shaped bonding material is flexible and conformable, allowing it to be precisely placed within the bonding area without extrusion. This ensures uniform pressure distribution during sintering and prevents material fall-off, improving reliability while maintaining ease of operation.
Solution Approach 2:
The sheet shape prevents extrusion before sintering occurs, anticipating and preventing the problem of material fall-off. By eliminating the extrusion issue beforehand, the bonding material remains securely in place throughout the sintering process.
3Ease of manufacture
If pasty bonding material is disposed and dried before semiconductor element placement, then bonding material is prepared, but semiconductor element may be damaged or misaligned
Solution Approach 1:
The sheet-shaped bonding material can be handled and placed without requiring a drying step. The flexible sheet can be directly positioned on the substrate and then the semiconductor element can be safely placed on top without risk of damage or misalignment, eliminating the problematic drying step entirely.
Solution Approach 2:
The bonding material is prepared in sheet form beforehand, which eliminates the need for the drying step that precedes element placement. This preliminary preparation in a different form factor avoids the harmful intermediate state that could damage or misalign the semiconductor element.
4Temperature
If bonding material with sinterability is used, then high temperature operation capability is achieved, but costs increase due to expensive materials and screen printing waste
Solution Approach 1:
The sheet-shaped bonding material can be precisely cut to size and placed only where needed, eliminating the material waste associated with screen printing. The flexible sheet format enables precise placement and reduces excess material usage while maintaining the sinterability required for high-temperature operation.
Solution Approach 2:
Changing the form from paste to sheet allows for more efficient material utilization. The sheet can be precisely dimensioned and placed, reducing waste while maintaining the high-temperature performance characteristics of sinterable bonding materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in high-quality, reliable bonding suitable for high-temperature operations, reducing manufacturing costs by minimizing material waste and preventing irregularities, while ensuring the semiconductor device's longevity and performance.
Implementation Method 1
sintering the bonding material while applying pressure to the bonding material between the substrate and the semiconductor element
Implementation Method 2
the bonding material includes particles of Ag or Cu, and the particles are coated with an organic film
Data Source
AI summary
A method for manufacturing a semiconductor device according to the present invention includes: (a) disposing, on a substrate (insulating substrate), a bonding material having a sheet shape and having sinterability; (b) disposing a semiconductor element on the bonding material after the (a); and (c) sintering the bonding material while applying pressure to the bonding material between the substrate and the semiconductor element. The bonding material includes particles of Ag or Cu, and the particles are coated with an organic film.