Sheet-Type Heat Pipe for Thin Mobile Device Thermal Management
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Solution Overview
Problem
Conventional heat dissipation structures in mobile devices, such as smartphones and tablets, fail to effectively diffuse heat generated by CPUs due to space constraints and the limitations of pipe-shaped heat pipes, leading to temperature issues and reduced performance of heat-generating components.
Innovation Solution
A sheet-type heat pipe is developed by stacking and joining etched metal sheets with a vapor passage and wicks, sealed to form a thin container, which is filled with an unwoven metal fiber cloth, allowing for efficient heat transport and installation in thin device chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pipe-shaped heat pipe is used for heat dissipation, then heat transport capability is improved, but the device thickness increases making it difficult to install in thin chassis
Solution Approach 1:
The invention transforms the traditional three-dimensional pipe-shaped heat pipe into a two-dimensional sheet-type structure. By flattening the heat pipe geometry, it maintains heat transport functionality while reducing the thickness dimension, enabling installation in thin mobile device chassis without compromising thermal performance
Solution Approach 2:
The sheet-type heat pipe is segmented into multiple functional layers including vapor generation region, vapor flow passage, and condensation region. These segments are arranged in a planar configuration rather than a tubular structure, allowing the heat dissipation function to be distributed across a two-dimensional area while maintaining thin profile
2Reliability
If a pipe-shaped heat pipe is used, then heat transport is achieved, but the heat diffusion area is limited and cannot cover wide regions
Solution Approach 1:
By transitioning from a one-dimensional tubular heat pipe to a two-dimensional sheet structure, the heat diffusion area is dramatically expanded. The planar geometry allows heat to be dissipated across a wide surface area of the mobile device, covering regions that extend beyond what a pipe-shaped heat pipe could achieve
Solution Approach 2:
The sheet-type heat pipe serves multiple functions simultaneously: it acts as a heat transport conduit, a heat diffusion plate, and a thermal management layer. This multi-functionality allows a single component to handle both heat removal from the CPU and widespread heat distribution across the device chassis
3Reliability
If the heat pipe diameter is increased to improve heat transport, then heat diffusion performance improves, but the available space inside the chassis is insufficient
Solution Approach 1:
The invention resolves the space constraint by flattening the heat pipe structure into a thin sheet. This dimensional transformation converts a volumetric component into a planar component, maintaining heat diffusion performance while reducing the space requirement from three-dimensional to two-dimensional, thus fitting within the limited chassis volume
Solution Approach 2:
The sheet-type heat pipe employs a thin-film construction with multiple layered components including vapor generation layers, wick structures, and sealing layers. This thin-film approach achieves the necessary heat diffusion functionality while minimizing the thickness and volume occupied within the mobile device chassis
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet-type heat pipe provides effective heat diffusion across a wide region of the device, alleviating heat spots and enabling full utilization of CPU performance while maintaining a thin profile, thus enhancing thermal conductivity and device efficiency.
Implementation Method 1
a vapor passage as a passage for vapor which is generated in the heat receiving portion
Implementation Method 2
grooves as wicks that are formed through etching
Implementation Method 3
a container formed by stacking and joining together at least two etched metal sheets
Data Source
AI summary
Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.