Electronic Shelf Label TFT Layout With Integrated NFC Coil

Solution Overview

Problem

The integration of an NFC coil into the FPC or PCB for electronic shelf labels results in a larger size, increased weight, and higher cost due to the need for a relatively large NFC coil, leading to thicker and heavier electronic shelf labels.

Innovation Solution

Integrating the NFC coil into the TFT substrate and connecting it to an IC or FPC to drive and control the NFC coil, utilizing a separate metal layer for the NFC coil wires within the TFT substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the NFC coil is integrated into the FPC or PCB to ensure good NFC function, then the NFC function is realized, but the size of the FPC or PCB increases, resulting in a thicker and heavier electronic shelf label and increased cost

Engineering Contradiction:

ImproveNFC functionVSAvoidweight of electronic shelf label

Core Design Contradiction:

ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent merges the NFC coil with the TFT substrate by forming the NFC coil wires using the same metal layers (first, second, and third metal layers) that constitute the TFT substrate structure. This integration allows the NFC coil to share the substrate space, eliminating the need for separate FPC or PCB areas dedicated to the NFC coil, thereby reducing overall weight while maintaining NFC functionality.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If the NFC coil is integrated into the FPC or PCB to ensure good NFC function, then the NFC function is realized, but the size of the FPC or PCB increases, resulting in a thicker and heavier electronic shelf label

Engineering Contradiction:

ImproveNFC functionVSAvoidthickness of electronic shelf label

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent merges the NFC coil with the TFT substrate by forming the NFC coil wires using the same metal layers (first, second, and third metal layers) that constitute the TFT substrate structure. This integration allows the NFC coil to share the substrate space, eliminating the need for separate FPC or PCB areas dedicated to the NFC coil, thereby reducing overall thickness while maintaining NFC functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If the NFC coil is integrated into the FPC or PCB to ensure good NFC function, then the NFC function is realized, but the size of the FPC or PCB increases, leading to increased cost

Engineering Contradiction:

ImproveNFC functionVSAvoidcost of FPC or PCB

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the NFC coil with the TFT substrate by forming the NFC coil wires using the same metal layers (first, second, and third metal layers) that constitute the TFT substrate structure. This integration allows the NFC coil to share the substrate space, eliminating the need for separate FPC or PCB areas dedicated to the NFC coil, thereby reducing overall cost while maintaining NFC functionality.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12580609B2Electronic shelf label

Publication Date: 2026.03.17 HANSHOW TECH CO LTD

AI summary

An electronic shelf label, including: a TFT substrate integrated with an NFC coil, wherein the NFC coil is configured to realize an NFC function and is connected to an IC or an FPC to drive and control the NFC coil. In examples, the NFC function is integrated into the TFT substrate, so that the size of an FPC or a PCB can be reduced, which not only makes the electronic shelf label thinner and lighter, but also realizes the NFC function without increasing the cost of the FPC or the PCB.