Shell-Less Ceramic Receptacle Connector for Low-Loss RF Coexistence
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Solution Overview
Problem
Existing connectors face issues such as high dielectric loss leading to signal attenuation, limited impedance optimization, heat generation causing reduced charging efficiency, susceptibility to deformation, and reduced antenna performance due to lack of a metal shell structure.
Innovation Solution
A metal shell-less receptacle connector using ceramic materials with low dielectric loss and high thermal conductivity, integrated metal contacts formed via direct copper plating, and a glass seal for improved waterproofing, connected via a flexible printed circuit board for simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic insulating material is used in connectors, then manufacturing cost is reduced and ease of manufacture is improved, but dielectric loss increases causing signal attenuation and heat generation
Solution Approach 1:
The patent uses ceramic material (alumina or aluminum nitride) instead of plastic insulating material. Ceramic provides low dielectric loss for high-frequency signal transmission while maintaining manufacturability through ceramic injection molding or tape casting processes. The ceramic insulator is integrated with metal contacts in a co-fired process, creating a composite structure that solves both signal integrity and manufacturing requirements.
2Strength
If metal shell structure is added to connectors, then strength and durability are improved, but frequency interference increases reducing antenna performance
Solution Approach 1:
The patent removes the metal shell structure from the connector design, creating a shell-less receptacle connector. This eliminates the source of frequency interference that would affect adjacent antenna performance. The ceramic insulator itself provides structural support and mechanical strength, replacing the need for a metal shell while maintaining connector durability without causing electromagnetic interference.
Solution Approach 2:
The patent changes the material parameter from metal to ceramic for the insulator body. Ceramic material provides high mechanical strength and rigidity comparable to or exceeding metal, while being electrically insulating and non-interfering with radio frequency signals. This material substitution resolves the contradiction between needing structural strength and avoiding frequency interference.
3Device complexity
If conventional punching process is used for metal contacts, then manufacturing simplicity is maintained, but line width optimization freedom is limited making impedance optimization difficult
Solution Approach 1:
The patent merges the metal contact formation with the ceramic insulator manufacturing process through direct copper plating or co-firing. The metal contacts are formed directly on the ceramic insulator surface or integrated during the ceramic firing process, eliminating the need for separate punching operations. This integrated approach allows precise control of contact geometry and line width for impedance optimization while maintaining manufacturing simplicity through a single co-fired process.
4Adaptability or versatility
If insertion and withdrawal operations are performed frequently, then connector versatility is improved, but insulator wear increases reducing lifetime
Solution Approach 1:
The patent uses ceramic material for the insulator instead of plastic. Ceramic provides high mechanical strength, hardness, and wear resistance, enabling the insulator to withstand frequent insertion and withdrawal operations without degradation. The ceramic-metal contact interface maintains stable electrical connection over time, significantly extending connector lifetime while preserving full operational versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed data transmission with optimized impedance, effective heat dissipation, enhanced durability, and reduced frequency interference, while maintaining antenna performance and facilitating mass production.
Implementation Method 1
a glass seal having an insertion hole into which an outer circumferential portion of the ceramic module is fitted
Implementation Method 2
heat dissipation performance may be improved due to high thermal conductivity
Data Source
AI summary
A metal shell-less receptacle connector includes a ceramic module, a glass seal having an insertion hole into which an outer circumferential portion of the ceramic module is fitted, and a ceramic support having a seal fastening hole into which an outer circumferential portion of the glass seal is fitted and fastening holes to which fasteners are fastened. Contacts and a ceramic material are integrated, whereby high data transmission is enabled due to impedance optimization and low loss characteristics, heat dissipation performance is improved due to high thermal conductivity, and durability is improved due to high strength. Shell-less structure reduces frequency interference, thereby improving the performance of an antenna positioned adjacent to the connector. Glass seal improves waterproof performance. Connector connects to a main board using a flexible printed circuit board, thereby improving the degree of freedom of position.