Close Patterning Shield Alignment for Uniform Electroplating
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Solution Overview
Problem
Existing electrochemical deposition systems face challenges in achieving uniformity of feature deposition on substrates due to inadequate alignment and spacing of close patterning shields, leading to suboptimal current focusing and reduced deposition uniformity, especially as critical dimensions of workpieces become smaller.
Innovation Solution
An automated system that delivers and aligns close patterning shields with workpieces within the electrochemical deposition module, ensuring precise positioning and optimal spacing for improved current focusing and uniformity, utilizing a shield holder and positioning mechanism to align apertures on the shields with target locations on the workpiece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If close patterning shields are used to focus current density, then deposition uniformity is improved, but alignment precision between shield apertures and workpiece target locations deteriorates
Solution Approach 1:
The system uses vision sensors to automatically detect the positions of fiducial markers on the workpiece and automatically adjusts the shield positioning mechanism to align apertures with target locations, eliminating manual alignment and enabling self-service automated positioning
Solution Approach 2:
The system implements feedback control by using vision sensors to detect actual positions of workpiece features, comparing them with desired positions, and automatically adjusting shield aperture positions to compensate for deviations, ensuring precise alignment
2Manufacturing precision
If manual alignment of close patterning shields is used, then device complexity is reduced, but deposition uniformity deteriorates
Solution Approach 1:
The system replaces manual mechanical alignment with an automated vision-guided positioning system that uses sensors to detect workpiece positions and actuators to adjust shield positions, substituting human operation with automated mechanical-electrical-optical integration
Solution Approach 2:
The positioning mechanism serves multiple functions: it holds the close patterning shield, enables automated positioning based on vision feedback, and allows dynamic adjustment during the electroplating process, making a single device perform multiple critical functions
3Manufacturing precision
If fixed spacing between shields and workpieces is used, then device complexity is reduced, but deposition uniformity deteriorates
Solution Approach 1:
The system transitions from fixed static spacing to dynamic adjustable spacing, where the distance between shield apertures and workpiece target locations can be automatically adjusted during the electroplating process based on real-time position detection and process requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated system enhances deposition uniformity by ensuring accurate alignment and spacing of close patterning shields, improving the precision and consistency of metal feature deposition on substrates, particularly for smaller critical dimensions.
Implementation Method 1
electrochemical deposition (ECD) are particularly critical
Data Source
AI summary
A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.