Shield Body Openings for Uniform Electroplating on 3D Substrates
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Solution Overview
Problem
Existing chemical and electrolytic surface treatment processes struggle to achieve uniform current distribution and efficient plating on substrates with varying feature densities and large scale 3D structures, particularly in micro and nano scales, due to limitations in current distribution control and substrate handling.
Innovation Solution
A shield body system with openings and an agitation unit that moves the shield body relative to the substrate, combined with a distribution body, to direct process fluid flow and current density distribution, ensuring precise alignment and uniform treatment through openings that correspond to substrate features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a patterned thick photoresist layer is used to guide current distribution, then current distribution can be controlled in the μm-range, but the main influence of current distribution at larger distances cannot be sufficiently achieved
Solution Approach 1:
The invention divides the current distribution control into two segments: a shield body with through-holes for macroscopic current distribution control, and a patterned thick photoresist layer for microscopic current distribution control. This segmentation allows each component to perform its specific function effectively without interfering with the other, resolving the contradiction between precision and complexity.
Solution Approach 2:
The shield body acts as an intermediary component between the power supply and the substrate. It receives the current distribution control from the macroscopic level through its through-holes and transfers it to the microscopic level where the photoresist layer operates, enabling both scales of control to work together harmoniously.
2Manufacturing precision
If shield body with through-holes is introduced for macroscopic current distribution, then current distribution at larger distances is improved, but additional device complexity is introduced
Solution Approach 1:
The invention merges the shield body with through-holes and the patterned thick photoresist layer into a single integrated system. The shield body provides macroscopic current distribution control while the photoresist layer provides microscopic control, and their combination creates a synergistic effect that achieves uniform current distribution across the entire substrate without requiring separate independent systems.
Solution Approach 2:
The shield body serves multiple functions: it acts as a current distribution controller at the macroscopic level, provides structural support, and works in conjunction with the photoresist layer to achieve precise current control at the microscopic level. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity.
3Manufacturing precision
If photoresist layer is used for current distribution control, then microscopic current distribution is achieved, but plating efficiency and uniformity on large substrates cannot be sufficiently improved
Solution Approach 1:
The invention segments the current distribution control into macroscopic and microscopic levels. The shield body with through-holes handles the macroscopic current distribution, enabling efficient plating on large substrates, while the patterned thick photoresist layer handles the microscopic current distribution control. This segmentation allows both high efficiency and high precision to coexist.
Solution Approach 2:
The invention adds a new dimension to the current distribution control by introducing the shield body at the macroscopic level (larger scale dimension), while maintaining the photoresist layer control at the microscopic level (smaller scale dimension). This dimensional expansion allows the system to address both large-scale efficiency and small-scale precision simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables higher plating efficiencies and uniformities by guiding current and electrolyte distribution on a macroscopic scale, focusing on microscopic areas, achieving uniform electroplating results in the nanometer range.
Implementation Method 1
The shield body has a plurality of openings to direct or allow a passage of the process fluid flow and/or a current density distribution towards the substrate to be treated
Implementation Method 2
The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body
Implementation Method 3
chemical and/or electrolytic surface treatment like electroless and electrochemical or electrolytic treatment or deposition
Implementation Method 4
current density distribution, which is uniformly distributed over the entire surface of a large substrate to be plated
Data Source
AI summary
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and/or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a deposition chamber for chemical and/or electrolytic surface treatment.