Shield Can Adhesive Bonding for PCB EMI Shielding

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Solution Overview

Problem

Existing electronic devices face challenges in effectively shielding electromagnetic interference due to gaps between shield cans and printed circuit boards, leading to reduced shielding effectiveness and increased manufacturing complexity and cost.

Innovation Solution

The use of a dual-shield can configuration where the first shield can is bonded to the front and rear surfaces of the printed circuit board with an adhesive, while the second shield can is connected to the side surface, eliminating the need for additional bonding members and enhancing electromagnetic interference shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a pad is attached to the PCB to fix the shield can, then the shield can can be secured to the PCB, but a space is formed between the shield can and the PCB leading to reduced shielding effectiveness

Engineering Contradiction:

Improveshielding effectivenessVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention removes the pad component from the assembly and modifies the shield can structure to directly contact the PCB. By extracting the intermediate pad element, the design eliminates the gap that caused shielding effectiveness issues while maintaining the securing function through direct contact and adhesive bonding.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of attaching the shield can to the PCB through a pad (indirect connection), the invention inverts the approach by making the shield can directly contact the PCB surface (direct connection). This reversal of the attachment sequence eliminates the space formation problem and improves shielding effectiveness.

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If a pad is attached to the PCB to fix the shield can, then the shield can can be secured to the PCB, but the width of the PBA is increased

Engineering Contradiction:

Improveshielding effectivenessVSAvoidPBA width

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The invention removes the pad component that was causing the width increase. By extracting this intermediate element and implementing direct contact between the shield can and PCB, the overall width of the PBA is reduced while maintaining shielding effectiveness.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of the pad and the shield can attachment into a single direct contact interface. By combining the securing function and eliminating the intermediate pad, the design achieves both functional integration and dimensional optimization.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If contact surfaces of the pad and PCB are plated to attach the pad to the PCB, then the pad can be securely attached, but a complex manufacturing process is required increasing manufacturing cost and time

Engineering Contradiction:

Improveattachment reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention removes the pad component that required complex plating processes. By extracting this intermediate element, the design eliminates the need for additional plating operations on multiple surfaces, thereby simplifying the manufacturing process while maintaining attachment reliability through direct contact and adhesive bonding.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces the complex plating process with a simpler adhesive bonding method. Instead of investing in multi-step plating operations, the design uses a more straightforward adhesive application process that achieves sufficient attachment reliability without the complexity and cost of electroplating.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances electromagnetic interference shielding effectiveness by reducing electromagnetic wave emission and simplifying the manufacturing process, thereby decreasing the overall width of the electronic device.

Implementation Method 1

an adhesive that bonds the shield can to the first surface, and that bonds the shield can to the second surface

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11032952B2Electronic device including shield can

Publication Date: 2021.06.08 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.