Shield Can Assembly Segmentation for Compact EMI Protection

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Solution Overview

Problem

As electronic devices become smaller and more compact, there is an increasing need to mitigate electromagnetic interference affecting internal components, which traditional shield cans fail to adequately address.

Innovation Solution

A shield can assembly comprising a combination of first and second shield members forming a partition wall around the shield area on the PCB, with a shield cover enclosing the assembly, effectively blocking electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a traditional shield can is used to cover electrical components, then electromagnetic interference protection is provided, but the device size and weight increase

Engineering Contradiction:
Improveelectromagnetic interference protectionVSAvoiddevice weight
Core Design Contradiction:
Object-affected harmful factorsVSWeight of moving object

Solution Approach 1:

The shield can assembly is divided into multiple segments: first shield members extending in a first direction, second shield members extending in a second direction perpendicular to the first direction, and a shield cover. This segmentation allows the shielding function to be distributed across multiple smaller components rather than requiring a single large shield can, thereby reducing overall device weight while maintaining EMI protection effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The shield members and shield cover are configured to enclose the shield area in a nested manner, with the shield cover covering the top surface and the shield members forming vertical walls. This nested structure provides comprehensive EMI shielding without requiring excessive material, optimizing the balance between protection and weight.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Object-affected harmful factors

If a traditional shield can is used to cover electrical components, then electromagnetic interference protection is provided, but the device volume increases

Engineering Contradiction:
Improveelectromagnetic interference protectionVSAvoiddevice volume
Core Design Contradiction:
Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The shield can assembly is divided into multiple segments: first shield members extending in a first direction, second shield members extending in a second direction perpendicular to the first direction, and a shield cover. This segmentation allows the shielding function to be distributed across multiple smaller components rather than requiring a single large shield can, thereby reducing overall device volume while maintaining EMI protection effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The shield members extend in multiple directions (first direction and second direction perpendicular to the first direction) to form a three-dimensional enclosure around the shield area. This multi-dimensional approach provides comprehensive EMI shielding without requiring excessive vertical height or horizontal footprint, optimizing the volume efficiency of the shielding structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If shield members extend in multiple directions to form a closed-loop structure, then EMI protection effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:
ImproveEMI protection effectivenessVSAvoidshield can assembly complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The complex closed-loop shield structure is segmented into standardized first shield members and second shield members that can be manufactured independently using standard PCB fabrication processes. Each shield member type can be produced using conventional techniques, and the overall complex shape is achieved through the arrangement of these simpler, standardized components rather than requiring complex monolithic manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple shield members are combined to form the complete closed-loop shield can assembly. The first shield members and second shield members are positioned and connected to create the final enclosed structure, allowing the complex EMI shielding geometry to be assembled from simpler individual components rather than manufactured as a single complex piece.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250212316A1Electronic device including shield can
Publication Date: 2025.06.26 SAMSUNG ELECTRONICS CO LTD
  • US20250212316A1 patent drawing
  • US20250212316A1 patent drawing
  • US20250212316A1 patent drawing

AI summary

An electronic device includes: a housing; a printed circuit board (PCB) in the housing and including a board surface that include a shield area and a shield can assembly disposed along a circumference of the shield area and connected to the PCB, the shield can assembly forming a partition wall perpendicular to the board surface. The shield can assembly includes at least one first shield member extending in a first direction, a plurality of second shield members including a first portion extending in a second direction perpendicular to the first direction and a second portion extending in the first direction; and a shield cover connected to the at least one first shield member and the plurality of second shield members and covering the shield area. The at least one first shield member and the plurality of second shield members enclose at least a portion of the shield area.