Shield Can Heat Dissipation Structure for PCB Component Cooling
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Solution Overview
Problem
Existing heat dissipation structures in electronic apparatuses are insufficient for effectively dissipating heat generated by high-performance electronic components, leading to performance deterioration.
Innovation Solution
A heat dissipation structure comprising a shield can with an opening, a contact member, a sheet member with first and second regions, and heat transfer members that transfer heat to a cover member for external release, while also providing protection against external impacts through a support structure and protrusion part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing heat dissipation structures are used, then device simplicity is maintained, but heat dissipation performance is insufficient for high-performance electronic components
Solution Approach 1:
The heat dissipation structure is divided into multiple functional segments: a shield can with opening for electromagnetic shielding and initial heat contact, a support structure for mechanical stability, contact members for thermal interface, sheet members for heat distribution, heat transfer members for conducting heat away, and a cover member for final heat dissipation. Each segment performs a specific function in the heat dissipation pathway, allowing the system to effectively manage heat from high-performance components while maintaining modular assembly.
2Temperature
If heat dissipation performance is improved through additional structures, then temperature control is enhanced, but protection against external impacts deteriorates
Solution Approach 1:
The shield can serves dual functions as both an electromagnetic shield and a heat dissipation component, while the support structure simultaneously provides mechanical support and impact protection. The cover member not only completes the heat dissipation pathway but also protects internal components from external impacts. This multi-functionality allows the structure to enhance heat dissipation without compromising impact protection.
3Power
If electronic components with higher performance are placed inside the electronic apparatus, then processing capability is improved, but heat generation increases beyond existing dissipation capacity
Solution Approach 1:
The contact members act as thermal interface materials that facilitate efficient heat transfer from the electronic components to the heat transfer members. The sheet members serve as intermediate heat distribution layers that spread heat across a larger area before it reaches the heat transfer members. These intermediary structures enable high-performance components to dissipate their increased heat generation effectively, maintaining processing capability without thermal overload.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance and protects electronic components from external impacts by efficiently transferring heat to the exterior and distributing impact forces.
Implementation Method 1
heat from the electronic component may be transferred to the metal structure through the thermal interface material and spread around the metal structure
Data Source
AI summary
An electronic apparatus having a printed circuit board (PCB); an electronic component disposed on the PCB; a shield can that is disposed on the PCB and includes an opening facing at least a portion of the electronic component; a support structure that is disposed between the PCB and the shield can and supports the shield can; a contact member that is at least partially located in the opening and covers a portion of the electronic component; a sheet member that includes a first region corresponding to the opening and a second region other than the first region and covers the contact member and the shield can; a first heat transfer member disposed on the sheet member; a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member; and a cover member covering the first heat transfer member and the second heat transfer member.