Miniaturized Shield Can with Conductive Base Layer for EMI Protection
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Solution Overview
Problem
Small-sized camera modules in mobile devices are prone to erroneous operations due to electromagnetic interference (EMI), which existing shielding solutions fail to adequately address while maintaining a compact design.
Innovation Solution
A camera module design featuring a miniaturized shield can that covers only the lens holder, with a conductive layer formed on the exposed lateral surface of the base, providing effective EMI shielding through a metal-materialed conductive layer and conductive adhesive, and using injection molding and metalizing techniques for efficient electromagnetic wave protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal-materialed shield can is used to protect the camera module from electromagnetic waves, then electromagnetic wave shielding is improved, but the volume and size of the camera module increases
Solution Approach 1:
The shield can is divided into two functional parts: a metal-materialed shield can for electromagnetic wave shielding and a conductive layer formed on the base for additional EMI protection. This segmentation allows the shield can to be miniaturized while maintaining shielding effectiveness through the complementary conductive layer.
Solution Approach 2:
The solution uses a composite shielding approach combining metal-materialed shield can and conductive layer formed on the base. This composite structure provides enhanced electromagnetic wave shielding with reduced volume compared to a traditional complete metal shield can.
2Volume of moving object
If the shield can is miniaturized to reduce volume, then the camera module size is reduced, but electromagnetic wave shielding effectiveness deteriorates
Solution Approach 1:
The shield can and base are merged into a unified shielding structure where the conductive layer is formed directly on the base surface. This merging creates a continuous shielding path that maintains EMI protection effectiveness while allowing the shield can to be miniaturized.
Solution Approach 2:
The shielding function is extended from the traditional three-dimensional shield can to include a two-dimensional conductive layer on the base surface. This dimensional expansion provides additional shielding paths and surfaces to block electromagnetic waves despite the reduced shield can volume.
3Reliability
If a complete metal shield can is used to protect the entire camera module, then electromagnetic wave shielding is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The complex complete metal shield can structure is simplified by extracting the essential shielding function and implementing it through a miniaturized shield can combined with a conductive layer on the base. This extraction reduces manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
Instead of using metal material throughout the entire shield can, the invention applies metal-materialed shield can only where needed for shielding and uses conductive layer on the base for additional EMI protection. This local quality approach simplifies manufacturing while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents EMI-induced errors in camera modules and other electronic devices by minimizing the shield can's volume while maintaining reliability, ensuring the optical system is protected from external electromagnetic waves.
Implementation Method 1
a conductive layer formed at the exposed lateral surface of the base
Implementation Method 2
the conductive layer may be connected to the PCB and the shield can using a conductive adhesive
Data Source
AI summary
A camera module according to exemplary embodiments of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a base arranged at an upper surface of the PCB, a lens holder arranged at an upper surface of the base to support plural sheets of lenses, a shield can configured to protect the lens holder by being coupled to the upper surface of the base to expose a lateral surface of the base, and a conductive layer formed at the exposed lateral surface of the base.