Shield Can Cooling Structure for Slim PCB Heat Dissipation

Solution Overview

Problem

Conventional cooling modules for electronic devices, such as fans, are bulky and difficult to integrate into slim devices due to their size and design, which can lead to ineffective heat dissipation and potential device failure from excessive heat generation by electrical elements like CPUs and GPUs.

Innovation Solution

A thin cooling module is implemented using a shield can with a recess area housing a metal structure with higher thermal conductivity, such as a water-cooled tube or metal plate, to efficiently dissipate heat from electrical elements, including CPUs and GPUs, through thermal sheets and air layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional cooling module (fan, heat sink) is used to cool electrical elements, then heat dissipation effectiveness is improved, but device thickness and weight increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The shield can and cooling module are merged into a single integrated structure. The shield can serves dual purposes: electromagnetic shielding and heat dissipation. The cooling module is integrated within the shield can structure, eliminating the need for separate cooling components and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shield can is designed to perform multiple functions simultaneously: electromagnetic interference shielding, structural support, and heat dissipation. This multi-functionality eliminates the need for separate dedicated cooling components, thereby reducing device thickness while maintaining effective heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a conventional cooling module is used to cool electrical elements, then heat dissipation effectiveness is improved, but device weight increases

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The shield can and cooling module are merged into a single integrated structure. The shield can serves dual purposes: electromagnetic shielding and heat dissipation. The cooling module is integrated within the shield can structure, eliminating the need for separate cooling components and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shield can is designed to perform multiple functions simultaneously: electromagnetic interference shielding, structural support, and heat dissipation. This multi-functionality eliminates the need for separate dedicated cooling components, thereby reducing device thickness while maintaining effective heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If cooling module components are placed next to electrical elements to prevent separation, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvecomponent stabilityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shield can and cooling module are merged into a single integrated structure. The shield can serves dual purposes: electromagnetic shielding and heat dissipation. The cooling module is integrated within the shield can structure, eliminating the need for separate cooling components and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for effective heat dissipation in slim electronic devices, reducing the risk of component failure and user discomfort from surface temperature increases while maintaining device slimness.

Implementation Method 1

a metal structure is mounted in the recess area to cool heat generated by the electrical element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

disperse the heat radiating from the electrical elements into surroundings through a thermal sheet or an air layer

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS12100637B2Electronic device including cooling structure

Publication Date: 2024.09.24 SAMSUNG ELECTRONICS CO LTD

AI summary

An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.