Shield Can and Shielding Sheet Structure for EMI Cooling Tradeoffs

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Solution Overview

Problem

Existing electronic devices face challenges in balancing electromagnetic interference shielding and heat dissipation, as opening the shield can for heat dissipation reduces shielding effectiveness, and closing it with a shielding film compromises performance.

Innovation Solution

A structure comprising a printed circuit board with a shield can, a shielding sheet, and a heat dissipation member, connected by a thermal interface material and an elastic member, forms interconnected cavities to maintain shielding while allowing enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the shield can cover is opened for heat dissipation, then heat dissipation performance is improved, but shielding effectiveness is reduced

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidshielding effectiveness

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The shield can cover is divided into multiple segments that can be selectively opened or closed. This allows heat dissipation through opened segments while maintaining shielding effectiveness through closed segments, resolving the contradiction between heat dissipation and EMI shielding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield can cover transitions from a static closed state to a dynamic state where segments can be adjusted. This dynamic adjustment enables the system to optimize both heat dissipation and shielding effectiveness based on operational requirements.

Inventive Principle:

Principle #15Dynamics

2Object-affected harmful factors

If the shield can cover is closed with a shielding film, then shielding effectiveness is maintained, but heat dissipation performance is compromised

Engineering Contradiction:

Improveshielding effectivenessVSAvoidheat dissipation performance

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

Different regions of the shield can cover have different properties - some areas are designed for shielding while others are designed for heat dissipation. This local differentiation allows simultaneous achievement of both shielding effectiveness and heat dissipation performance.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The shield can cover uses composite material structures that combine EMI shielding properties with thermal management properties. This composite approach enables the cover to simultaneously provide both shielding effectiveness and heat dissipation capability.

Inventive Principle:

Principle #40Composite materials

3Object-affected harmful factors

If contact area between shielding components is increased, then shielding effectiveness is improved, but device complexity increases

Engineering Contradiction:

Improveshielding effectivenessVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Multiple shielding components are merged into an integrated shield can structure with built-in contact areas. This merging reduces the number of separate parts and assembly steps while maintaining effective shielding contact, thus improving shielding effectiveness without proportionally increasing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shield can cover structure serves multiple functions simultaneously - EMI shielding, heat dissipation, and mechanical support. This multi-functionality reduces the need for separate dedicated components, thereby improving shielding effectiveness without commensurately increasing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved electromagnetic interference shielding and effective heat dissipation by ensuring wide contact areas and reduced contact resistance, enhancing overall performance.

Implementation Method 1

a thermal interface material (TIM) disposed between the heat dissipation member and the electronic component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an elastic member disposed between the first part of the shielding sheet and the heat dissipation member in the second cavity to provide an elastic force to the first part

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20260033342A1Electronic device having shielding and heat dissipation structure

Publication Date: 2026.01.29 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device is provided. The electronic device includes a shield can including a first cavity and a first opening to communicate with the first cavity, an electronic component disposed in the first cavity, a shielding sheet disposed at an upper portion of the shield can, communicating with the first cavity, and defining a second cavity, the shielding sheet including a first part contacting the shield can, a heat-dissipation member disposed on the shielding sheet to close the second cavity, and a thermal interface material (TIM) disposed between the heat-dissipation member and the electronic component. The shield can, the shielding sheet, and the heat-dissipation member are electrically connected to each other, the electronic component, the TIM, and the heat-dissipation member are thermally connected to each other, the first cavity has a first width, and the second cavity has a second width, greater than the first width.