Shield-Can Film Structure for Dent-Free Marking During Assembly
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Solution Overview
Problem
In the manufacturing of electronic apparatuses, the removal of protective films during assembly can lead to defects such as dents on shield-cans, making subsequent assembly processes challenging and difficult to rework.
Innovation Solution
A method involving a first film with a body and handle attached to the shield-can, including a chamfered corner and adhesive layer, and a second film with a filler layer, to protect the shield-can and facilitate the formation of identification marks without altering the manufacturing process, thereby reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective films are removed during assembly, then the shield-can surface may be damaged causing dents, but keeping protective films attached prevents identification mark formation
Solution Approach 1:
The protective film is divided into two distinct films: a first protective film that remains attached to the shield-can throughout assembly to prevent surface damage, and a second protective film that is removed to enable identification mark formation. This segmentation allows each film to serve its specific function without interfering with the other process requirements.
Solution Approach 2:
The first protective film is applied to the shield-can surface before assembly begins, providing preemptive protection against dents and surface damage during the entire assembly process. This preliminary protective action ensures surface integrity is maintained from the start, eliminating the need to remove protective films later.
2Reliability
If a protective film covers the entire shield-can, then the shield-can is protected from damage, but subsequent assembly processes become difficult and rework is challenging
Solution Approach 1:
The protective film system is segmented into two separate films with different removal timelines. The first film remains attached for continuous protection during assembly, while the second film is removed after serving its protective purpose. This segmentation enables easy access to the shield-can surface for rework and repair operations without compromising the protective coverage during critical assembly phases.
3Manufacturing precision
If the manufacturing process is changed to prevent defects, then defect reduction is achieved, but existing manufacturing methods must be altered
Solution Approach 1:
The first protective film is applied to the shield-can before assembly operations begin, providing preemptive protection that prevents dents and surface defects during the assembly process. This preliminary protective measure eliminates defects without requiring changes to the subsequent assembly manufacturing steps, maintaining process simplicity while achieving high manufacturing precision.
Solution Approach 2:
The first protective film acts as an intermediary element between the shield-can surface and the assembly tools/operations. It mediates the interaction by absorbing potential damage during assembly, allowing existing manufacturing methods to continue unchanged while preventing defect formation. This intermediary approach adds no complexity to the manufacturing process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes defects on the shield-can during assembly and allows for easy identification mark formation, enhancing the assembly process without changing existing manufacturing methods.
Implementation Method 1
the first film includes an adhesive layer and a film layer disposed on the adhesive layer, wherein the adhesive layer is bonded to the shield-can
Data Source
AI summary
An electronic apparatus includes: a circuit board; a driving chip mounted on the circuit board; a shield-can including a top surface and a side surface extending in a direction from the top surface to the circuit board, wherein the top surface covers the driving chip; and a first film disposed on the shield-can and including a first opening that exposes a part of the top surface of the shield-can.