Low-Profile Shield Can for PCB EMI Protection
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Solution Overview
Problem
Conventional electromagnetic shielding solutions for computing devices limit device size and mechanical robustness due to increased height requirements, which restricts the design of thinner, more compact electronic devices.
Innovation Solution
A two-piece electromagnetic shielding can design that is soldered to a printed circuit board (PCB) with a removable cross-bar and a lid, allowing for a low-profile configuration that minimizes overall thickness while maintaining effective shielding, and is compatible with Pick and Place and Surface Mount Technology (SMT) processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional electromagnetic shielding solutions are used, then EMI protection is provided, but device height and thickness increase
Solution Approach 1:
The shielding can is divided into two separate pieces: a frame piece and a lid piece. The frame is soldered directly to the PCB, eliminating the need for a separate mounting structure, while the lid attaches to the frame to complete the shielding enclosure. This segmentation allows the shielding function to be achieved with minimal thickness while maintaining structural integrity.
Solution Approach 2:
The patent transitions from conventional three-dimensional shielding structures to a two-dimensional planar configuration. The frame and lid are designed to attach directly to the PCB surface, converting the shielding problem from a volumetric constraint to a surface-mounted solution, thereby minimizing the height profile while maintaining EMI protection.
2Object-affected harmful factors
If conventional shielding structures are used, then electromagnetic shielding is provided, but manufacturing complexity increases
Solution Approach 1:
By separating the shielding structure into a frame and a lid, each component can be manufactured independently using standard PCB fabrication processes. The frame is designed with through-holes for direct soldering to the PCB, while the lid attaches to the frame, allowing both parts to be produced through conventional manufacturing techniques without requiring complex integrated structures.
Solution Approach 2:
The patent replaces complex mechanical mounting structures with direct soldering connections. The frame includes through-holes that allow it to be soldered directly to the PCB, eliminating the need for separate mechanical fasteners, clips, or mounting brackets. This substitution of mechanical assembly with electrical soldering simplifies the manufacturing process and improves reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding can design achieves a low height profile, reducing the overall thickness of computing devices while providing effective electromagnetic interference (EMI) protection, allowing for thinner and more robust device designs without compromising shielding performance.
Implementation Method 1
a shield can configured to provide an electromagnetic shield for the one or more components
Data Source
AI summary
A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.