Shield Can TIM Layout for PCB Heat Dissipation
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Solution Overview
Problem
Electronic devices generate heat during operation, leading to temperature increases that can deteriorate their functionality, and existing thermal interface materials may not effectively manage heat dissipation.
Innovation Solution
The electronic device incorporates a thermal interface material injected through a through hole in a shield can, occupying space between the shield can and electronic components, allowing for efficient heat diffusion and temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is used to transfer heat from electronic components, then heat diffusion is improved, but the enclosed space must be completely filled which increases device complexity
Solution Approach 1:
The patent extracts the thermal interface material from the enclosed space by providing an opening that allows the material to extend outward. This eliminates the requirement to completely fill the enclosed space, reducing device complexity while maintaining heat transfer functionality.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional configuration by allowing the thermal interface material to extend vertically outward from the enclosed space through the opening. This dimensional change enables heat transfer without requiring complete space filling.
2Temperature
If thermal interface material is injected through a through hole, then heat transfer efficiency is improved, but the injection process complexity increases
Solution Approach 1:
The through hole serves multiple functions: it acts as a passage for injecting the thermal interface material and simultaneously serves as a structural feature of the shield can. This multi-functionality reduces overall process complexity while enabling effective heat transfer.
3Object-affected harmful factors
If shield can covers electronic component completely, then electromagnetic shielding is improved, but heat dissipation space is reduced
Solution Approach 1:
The shield can is segmented by introducing an opening that divides the otherwise enclosed space. This segmentation allows the thermal interface material to extend outward, creating additional heat dissipation space while maintaining electromagnetic shielding in the covered regions.
Solution Approach 2:
The opening is strategically positioned and sized to provide sufficient heat dissipation space locally without compromising the overall electromagnetic shielding performance of the shield can structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat, preventing temperature increases and maintaining device functionality by utilizing a thermal interface material strategically placed within the electronic device.
Implementation Method 1
Heat generated from the electronic component may be diffused through the thermal interface material
Data Source
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AI summary
An electronic device is provided. The electronic device comprises: a printed circuit board including a through-hole; an electronic component disposed on the printed circuit board; a shield can covering the electronic component; and a thermal interface material (TIM) contained in the space between the printed circuit board and the shield can. The thermal interface material occupies the space between the surface of the electronic component and the shield can, and comes into contact with a first electronic component. The space between the printed circuit board and the shield can is connected to the space outside the shield can through an opening.