Shield Cap with Interposed Metal Layer for EMI Shielding
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Solution Overview
Problem
Existing shield caps for electronic components fail to provide adequate electromagnetic shielding and structural integrity, leading to potential malfunctions due to deflection and bending, which compromises their ability to protect electronic components from electromagnetic interference and physical impacts.
Innovation Solution
A shield cap design featuring a cap member with a conductive film and a metal layer interposed between the conductive film and the side wall portion, combined with a reinforcing material in the resin cap member, forming a structure that accommodates electronic components and enhances shielding and heat dissipation while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a shield cap is made with a simple structure, then manufacturing cost is reduced, but electromagnetic shielding performance and structural integrity deteriorate
Solution Approach 1:
The shield cap uses a composite structure combining a resin cap member with a metal layer and conductive film. The resin cap member provides structural integrity while the metal layer and conductive film provide electromagnetic shielding. This composite approach achieves both cost-effectiveness and high shielding performance by combining materials with complementary properties.
Solution Approach 2:
The metal layer is selectively formed only on the fourth surface of the side wall portion where it is most needed for shielding, rather than covering the entire cap member. The conductive film is applied to specific surfaces (second surface of ceiling portion and sixth surface of side wall portion) to provide targeted electromagnetic shielding. This localized application reduces material costs while maintaining effective shielding performance.
2Volume of moving object
If the cap member is made thinner to reduce size, then the accommodation space is reduced, but weight and complexity are reduced
Solution Approach 1:
The resin cap member is designed with integrated reinforcement structures (ridges and grooves) that provide high structural strength despite the thin overall thickness. The reinforcement structures distribute stress and prevent deformation, allowing the cap member to maintain structural integrity at reduced thickness while accommodating electronic components.
Solution Approach 2:
The side wall portion is divided into multiple surfaces (third, fourth, fifth, sixth surfaces) with the metal layer applied selectively to the fourth surface. The ceiling portion has distinct surfaces (first and second surfaces) with conductive film applied to the second surface. This segmentation allows optimized material placement and structural design that maintains strength while minimizing overall thickness.
3Reliability
If a metal layer is added to the cap member, then electromagnetic shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The metal layer formation process is integrated with the cap member manufacturing process. The resin cap member is formed with the metal layer already applied to the fourth surface of the side wall portion, and the conductive film is applied to specific surfaces in the same manufacturing sequence. This integrated approach reduces the number of separate manufacturing steps and simplifies production while achieving effective electromagnetic shielding.
4Reliability
If the conductive film is applied to all surfaces, then electromagnetic shielding is maximized, but manufacturing cost and time increase
Solution Approach 1:
The conductive film is applied selectively only to the second surface of the ceiling portion and the sixth surface of the side wall portion, rather than all surfaces. The metal layer is applied only to the fourth surface of the side wall portion. This localized application provides effective electromagnetic shielding at the critical interfaces while significantly reducing material costs and manufacturing time compared to full-surface coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields electronic components from electromagnetic interference, improves heat dissipation, and maintains structural integrity, reducing the risk of malfunctions and physical damage by suppressing deflection and bending of the cap member.
Implementation Method 1
a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves
Implementation Method 2
a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion
Data Source
AI summary
A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.