Shield Case Asymmetric Dimples Display Device Cooling
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Solution Overview
Problem
Display devices face performance deterioration and potential damage due to ineffective cooling of heat-generating elements, which can lead to reduced performance and reliability.
Innovation Solution
The implementation of a shield case with asymmetric dimples and ribs in the display device, where the dimples are concave and have a depth-to-diameter ratio of 0.1 or more, and the ribs protrude towards the control circuit board, enhancing airflow turbulence and cooling efficiency by forming a cooling path that overlaps with heat-generating elements like the signal controller and PMIC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional shield case is used without dimples, then the structure is simple and easy to manufacture, but the cooling performance is insufficient and heat-generating elements overheat
Solution Approach 1:
The patent applies asymmetry by forming dimples with asymmetric cross-sections (different depths at different locations) on the shield case surface. This asymmetric geometry creates non-uniform airflow patterns and turbulence that enhance convective heat transfer from the heat-generating elements, effectively lowering their temperature while maintaining a relatively simple overall shield case structure.
Solution Approach 2:
The patent employs curvature by forming dimples (concave spherical or hemispherical indentations) on the shield case surface. These curved dimple structures disrupt laminar airflow and generate turbulence, increasing the heat exchange efficiency between the cooling air and heat-generating elements, thereby improving cooling performance without significantly complicating the manufacturing process.
2Productivity
If dimples are formed on the shield case to improve cooling, then cooling performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the dimple geometry parameters (depth, diameter, spacing, and asymmetric depth ratios) to achieve effective cooling. By carefully selecting these parameters, the patent enhances cooling efficiency while keeping the dimple formation process compatible with conventional manufacturing methods, thus balancing manufacturing complexity with cooling performance.
3Temperature
If asymmetric dimples are used to generate turbulence, then cooling performance is significantly improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes asymmetry in dimple design where different regions of the dimple have different depths (e.g., first depth in a first region, second depth in a second region). This asymmetric configuration generates effective turbulence for cooling while allowing for manufacturing through techniques like selective machining or molding, where the asymmetric pattern can be replicated with moderate precision rather than requiring ultra-precise individual dimple formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves cooling performance by generating turbulence, effectively reducing the temperature of heat-generating components, thereby enhancing the reliability and longevity of the display device.
Implementation Method 1
The asymmetric dimples may generate turbulence in a flow of air that passes through the space defined by the shield case and the control circuit board
Implementation Method 2
a fan disposed on the chassis and adjacent to the shield case
Data Source
AI summary
A display device includes a display panel; a chassis disposed at a rear side of the display panel; a control circuit board disposed on the chassis; a shield case disposed on the control circuit board; and a fan disposed on the chassis and adjacent to the shield case. The shield case includes a main portion spaced apart from the control circuit board in a third direction, and side portions extending toward the chassis from opposite sides of the main portion. Dimples are formed in an inner surface of the main portion facing toward the control circuit board.