Shield Case Fixing via Conductive Resin Columnar Member
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Solution Overview
Problem
The existing high-frequency components with shield cases face challenges in reducing size due to the need for space for concave portions and adhesives, which hinder miniaturization.
Innovation Solution
A high-frequency component design featuring a conductive resin columnar member that fixes the shield case to the wiring substrate without requiring additional space for adhesives or concave portions, utilizing a lid plate with bent edges for positioning and a connecting member made of the same conductive resin for heat dissipation and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield case is fixed to a module substrate using adhesives and concave portions, then the shield case can be securely attached, but the size of the high-frequency component increases due to the space required for these features
Solution Approach 1:
The invention merges the fixing function and the grounding function into a single columnar member. The columnar member both secures the shield case to the module substrate and provides electrical connection to the ground electrode, eliminating the need for separate adhesive applications and concave portions, thereby reducing component size while maintaining fixing reliability
Solution Approach 2:
The columnar member serves multiple functions simultaneously: it acts as a mechanical fastener to fix the shield case, provides electrical grounding connection, and serves as a structural support element. This multi-functionality reduces the number of separate components needed, achieving miniaturization without compromising reliability
2Reliability
If concave portions are formed in the module substrate for ground electrodes, then proper grounding connection is achieved, but the substrate area is reduced and component size increases
Solution Approach 1:
The invention transitions from a two-dimensional ground electrode pattern on the substrate surface to a three-dimensional columnar structure that rises from the substrate. The columnar member with its upper electrode provides vertical grounding connection, eliminating the need for extensive surface concave portions and allowing more efficient use of substrate area
3Strength
If adhesive is applied to fix the shield case, then secure attachment is achieved, but additional space is required around the shield case
Solution Approach 1:
The invention extracts the adhesive from the fixing mechanism and replaces it with a mechanical interlocking structure. The columnar member physically secures the shield case through its integration with the module substrate, eliminating the need for adhesive material and the surrounding space it would occupy, thereby reducing overall component volume while maintaining attachment strength
Data Source
AI summary
A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.