Electronic Component Package Shield Case Insert-Molding

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Solution Overview

Problem

Existing electronic component packages lack effective shielding, leading to noise susceptibility and risks of short-circuiting during reflow soldering, particularly due to the absence of a shield case and the proximity of hot terminals to the shield case.

Innovation Solution

An electronic component package with a shield case insert-molded into a resin case, where the hot terminal is inserted through a through hole in the shield case without contact, ensuring the inner and outer surfaces of the shield case are covered with resin, reducing the risk of short-circuiting and enhancing shielding performance. Additionally, a shield cover can be attached to the top edge of the resin case for further shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shield case is added to improve noise resistance, then shielding performance is improved, but the risk of short-circuiting between hot terminals and shield case increases

Engineering Contradiction:

Improvenoise resistanceVSAvoidshort-circuit risk

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent introduces resin as an intermediary material between the hot terminals and the shield case. The resin case encapsulates both the shield case and hot terminals, creating an insulating barrier that prevents direct contact and potential short-circuiting while maintaining the shielding effectiveness against noise.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the package structure into distinct functional zones: the shield case for noise protection, the hot terminals for signal transmission, and the resin case for insulation and structural support. This spatial segmentation allows each component to perform its function without interfering with others, particularly preventing electrical contact between conductive elements.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If hot terminals are positioned near the shield case for compact design, then device size is reduced, but short-circuit risk increases due to solder flow

Engineering Contradiction:

Improvepackage sizeVSAvoidshort-circuit risk

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The resin case serves as a mediator that fills the space between the hot terminals and shield case, allowing compact positioning while preventing solder flow from causing short-circuits. The resin acts as both structural support and electrical insulation in the confined space.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The resin case is formed in advance to preemptively block the path of solder flow before reflow soldering occurs. This preliminary protective action prevents potential short-circuiting between the hot terminals and shield case during the assembly process.

Inventive Principle:

Principle #9Preliminary anti-action

3Device complexity

If the bottom side of the circuit substrate is left exposed for simple structure, then manufacturing complexity is reduced, but noise resistance deteriorates

Engineering Contradiction:

Improvestructure complexityVSAvoidnoise resistance

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent merges the shield case structure to extend over the bottom side of the circuit substrate, providing comprehensive noise protection. The resin case simultaneously encapsulates both the top and bottom sides, creating a unified protective enclosure that shields the entire circuit from electromagnetic interference without requiring separate shielding components.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides high shielding performance, reduces the risk of short-circuiting, and allows for efficient manufacturing with maintained positional accuracy of the hot terminal and shield case, while preventing solder flow during assembly.

Implementation Method 1

a shield case (10) and a hot terminal (20) which are made of different materials from each other and are insert-molded in the resin case (2)

Methodology Applied

Scientific EffectInsert molding:

Data Source

PatentEP1885171B1Package for electronic component, electronic component using such package, and method for producing package for electronic component

Publication Date: 2012.11.07 MURATA MFG CO LTD

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AI summary

[Object] To provide an electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. [Solving Means] A package 1 includes a shield case 10 formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole 13; a resin case 2 molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal 20 that is insert-molded in the resin case such that the hot terminal is inserted into the shield case 10 through the through hole 13 without contact, one end of the hot terminal is exposed at an inner surface of the resin case 2, and the other end of the hot terminal is exposed at an outer surface of the resin case 2. An element S contained in the package 1 is surrounded by the shield case 10 so that good shielding performance is obtained.