Shield Case Ring-Shaped Terminal for Delamination Prevention
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Solution Overview
Problem
Shield case delamination from substrates occurs due to stress from temperature changes and impacts, leading to increased solder usage and inspection time, and requires larger substrate dimensions or reduced component areas.
Innovation Solution
A shield case with a top panel, terminal leg portions, and side plate portions, featuring a ring-shaped terminal portion with a leg portion, joint portion, and projecting support, formed through sheet metal processing to enhance mechanical strength and solder joint integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering portions are increased to improve connection strength, then connection strength is improved, but usage of solder increases and inspection time increases
Solution Approach 1:
The shield case is divided into multiple functional portions: terminal leg portions with ring-shaped cross-sections for electrical connection, side plate portions for mechanical support, and top panel portions for coverage. This segmentation allows each portion to be optimized for its specific function, reducing the need for excessive soldering areas while maintaining connection strength.
Solution Approach 2:
The terminal leg portions are designed with ring-shaped cross-sections at specific locations where connection is needed, concentrating the soldering area only where required rather than uniformly across the entire shield case. This local quality approach maintains connection strength while minimizing overall solder usage and inspection time.
2Strength
If soldering portions are increased to improve connection strength, then connection strength is improved, but manufacturing cost increases
Solution Approach 1:
The shield case is divided into multiple functional portions: terminal leg portions with ring-shaped cross-sections for electrical connection, side plate portions for mechanical support, and top panel portions for coverage. This segmentation allows each portion to be optimized for its specific function, reducing the need for excessive soldering areas while maintaining connection strength.
Solution Approach 2:
The terminal leg portions are designed with ring-shaped cross-sections at specific locations where connection is needed, concentrating the soldering area only where required rather than uniformly across the entire shield case. This local quality approach maintains connection strength while minimizing overall solder usage and inspection time.
3Device complexity
If shield case structure is simplified to reduce complexity, then device complexity is reduced, but mechanical strength decreases
Solution Approach 1:
The terminal leg portions are designed with ring-shaped cross-sections instead of simple rectangular or circular sections. This curved, ring-shaped geometry provides higher moment of inertia and better stress distribution, enhancing mechanical strength without significantly increasing structural complexity. The curved surfaces also improve solder joint quality by distributing thermal and mechanical stresses more evenly.
Data Source
AI summary
A shield case for covering an electronic component includes a top panel portion made of a metal plate, a plurality of terminal leg portions formed to project in a direction intersecting with the top panel portion from a peripheral edge portion thereof, and a side plate portion formed to project in the direction intersecting with the top panel portion from a peripheral edge portion of the top panel portion other than the plurality of terminal leg portions. Each of the plurality of terminal leg portions includes a leg portion that stretches from the top panel portion, a joint portion that extends in a direction intersecting with the leg portion from a distal end of the leg portion, and a terminal portion with a ring-shaped cross-sectional surface that has a projecting support abutting on the leg portion from a distal end of the joint portion.