Electronic Device Shield with Conductive Traces for Thermal Dissipation
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Solution Overview
Problem
Existing security barriers for computer components are expensive to manufacture and inefficient at dissipating heat, leading to reduced processor performance due to overheating, and are vulnerable to unauthorized access and detection by external scanning devices.
Innovation Solution
A shield with traces comprising an inner conductive and outer non-conductive portion, generated using three-dimensional printing techniques, which provides thermal conductivity for heat dissipation and detects penetration attempts while being difficult to detect using external scanning methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional security barriers are used, then security protection is provided, but manufacturing cost increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent employs composite materials consisting of conductive plastic and non-conductive plastic in a layered structure. The conductive plastic layer provides thermal conductivity for heat dissipation, while the non-conductive plastic layer provides electrical insulation and security detection capabilities. This composite structure resolves the contradiction by integrating multiple functions into a single material system that is both cost-effective and high-performance.
Solution Approach 2:
The shield structure serves multiple functions simultaneously: it provides security barrier protection, thermal conductivity for heat dissipation, electrical insulation, and intrusion detection capabilities. By consolidating these functions into a single multi-functional component, the patent reduces manufacturing complexity and cost while maintaining high reliability.
2Reliability
If conventional security barriers are used, then security protection is provided, but heat dissipation efficiency decreases leading to reduced processor performance
Solution Approach 1:
The patent employs composite materials consisting of conductive plastic and non-conductive plastic in a layered structure. The conductive plastic layer provides thermal conductivity for heat dissipation, while the non-conductive plastic layer provides electrical insulation and security detection capabilities. This composite structure resolves the contradiction by integrating multiple functions into a single material system that is both cost-effective and high-performance.
Solution Approach 2:
The shield structure implements local quality by having different material properties in different layers: the conductive plastic layer is optimized for thermal conductivity in specific regions where heat generation occurs, while the non-conductive layer provides insulation where electrical security is critical. This localized optimization allows simultaneous achievement of heat dissipation and security protection.
3Reliability
If conventional security barriers are used, then security protection is provided, but vulnerability to external scanning detection increases
Solution Approach 1:
The shield structure implements local quality by having different material properties in different layers: the conductive plastic layer is optimized for thermal conductivity in specific regions where heat generation occurs, while the non-conductive layer provides insulation where electrical security is critical. This localized optimization allows simultaneous achievement of heat dissipation and security protection.
Solution Approach 2:
The patent uses non-conductive plastic that mimics the appearance and physical properties of conventional insulating materials, making it difficult for external scanning devices to distinguish from legitimate shield structures. This camouflage effect, combined with the functional differentiation between conductive and non-conductive layers, creates a security barrier that is both effective and undetectable by external scanning methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield effectively prevents unauthorized access, maintains processor performance by dissipating heat, and confuses external scanning devices, ensuring secure data protection.
Implementation Method 1
The shield may be generated with thermally conductive plastic. Accordingly, thermal coupling may be provided between the shield and a heat generating electronic component, such as a processor.
Implementation Method 2
A resistance of the conductive portion of a trace changes in response to contact from a source external to the shield.
Data Source
AI summary
Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.