RF Module Shield Contact Structure for Transmission Filter Heat Dissipation
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Solution Overview
Problem
Existing radio-frequency modules face challenges in improving heat dissipation capability, leading to increased temperatures of transmission filters.
Innovation Solution
A radio-frequency module design that includes a mounting substrate with transmission filters covered by a resin layer and a shield layer, where at least part of the transmission filters and metal members are in contact with the shield layer, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If transmission filters are mounted on the mounting substrate without additional heat dissipation structures, then the device complexity is reduced, but the temperature of the transmission filters increases
Solution Approach 1:
A shield layer is introduced as an intermediary component between the transmission filters and the surrounding environment. This shield layer serves as a heat dissipation pathway, conducting heat away from the transmission filters without requiring fundamental changes to the filter structure itself, thus resolving the contradiction between temperature control and structural simplicity
Solution Approach 2:
The shield layer is designed to perform multiple functions simultaneously: it provides electromagnetic shielding and serves as a heat dissipation structure. By making the shield layer contact the transmission filters, it becomes a multi-functional component that addresses both interference protection and thermal management needs
2Loss of energy
If a shield layer is added to cover the transmission filters, then heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The shield layer is merged with existing structural elements of the radio-frequency module. Rather than being a completely separate component, the shield layer is integrated into the module's housing or support structure, allowing heat dissipation functionality to be added without proportionally increasing overall device complexity
Solution Approach 2:
The shield layer extends in multiple spatial dimensions to maximize heat dissipation surface area. By creating a three-dimensional heat dissipation pathway that contacts the transmission filters from multiple directions, the structure efficiently dissipates heat without requiring a proportional increase in the overall volume or complexity of the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation capability, effectively managing temperature increases in transmission filters.
Implementation Method 1
At least part of a major surface of each of at least two transmission filters of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer
Data Source
AI summary
Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on the first major surface of the mounting substrate. The resin layer is disposed on the first major surface of the mounting substrate and covers at least part of an outer peripheral surface of each of the plurality of transmission filters. The shield layer covers the resin layer and at least part of each of the plurality of transmission filters. At least part of a major surface of each of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer.