Semiconductor Package Shield Groove Structure for EMI Control
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Solution Overview
Problem
The increasing complexity and operating speed of semiconductor chips lead to electromagnetic interference (EMI) challenges in system-level packaging, necessitating effective electromagnetic shielding solutions.
Innovation Solution
A semiconductor package design featuring a circuit board with semiconductor chips, a molding, and an electromagnetic shield, where ground wires penetrate the molding and shield, with a groove in the molding filled by the shield to expose the wires, simplifying fabrication and reducing metal burrs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic shield is formed to cover the entire side surface of the molding, then electromagnetic interference shielding is improved, but the risk of metal burrs increases and fabrication complexity increases
Solution Approach 1:
The electromagnetic shield is segmented into multiple portions: a first portion filling the groove and exposing ground wires, and a second portion covering the upper surface. This segmentation allows the shield to provide EMI protection while avoiding complete side surface coverage, reducing metal burrs and simplifying fabrication.
Solution Approach 2:
The electromagnetic shield provides localized protection where needed: the first portion shields the groove area and ground wires, while the second portion shields the upper surface. This local quality approach ensures EMI shielding effectiveness without requiring complete coverage, thereby reducing manufacturing complexity and metal burr formation.
2Object-affected harmful factors
If ground wires are completely covered by the electromagnetic shield, then electromagnetic shielding is improved, but connectivity and ease of repair are worsened
Solution Approach 1:
The ground wires are extracted from complete coverage by the electromagnetic shield. The first portion of the shield is designed to expose the ground wires, allowing them to be accessible for connectivity purposes while still providing EMI shielding in other areas.
Solution Approach 2:
The electromagnetic shield acts as an intermediary that selectively shields certain areas while leaving ground wires exposed. This mediator approach provides EMI protection for sensitive components while maintaining wire accessibility for testing and repair.
3Object-affected harmful factors
If the electromagnetic shield fills the entire groove and covers all surfaces, then shielding effectiveness is improved, but device complexity and material usage increase
Solution Approach 1:
The electromagnetic shield applies partial action by covering only the necessary areas: the groove filled with the first portion and the upper surface with the second portion. This partial coverage provides sufficient EMI shielding effectiveness without the excessive complexity and material usage that would result from complete coverage.
Data Source
AI summary
A semiconductor package is capable of reducing electromagnetic interference (EMI). The semiconductor package includes a circuit board, semiconductor chips mounted on the circuit board, a molding formed on the circuit board and covering each of the semiconductor chips, an electromagnetic shield formed on the circuit board and covering the molding and ground wires connected to ground pads, which are installed on the circuit board. The ground wires penetrate the molding and the electromagnetic shield.