Conductive Shield Grounding Contacts EMI Leakage
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Solution Overview
Problem
Conductive shields for electronic components are often costly to manufacture and limited in adaptability for different applications, failing to effectively impede electromagnetic interference (EMI) leakage without impacting performance.
Innovation Solution
The design includes a conductive shield with discrete grounding contacts and sidewalls stamped from sheet metal, which are easily adaptable and cost-effective, providing a cavity to surround electronic components and electrically couple to a printed circuit's ground conductor through compliant pins and wall-engaging segments, ensuring even distribution and secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive shield is designed for particular applications with integrated terminals, then EMI shielding effectiveness is improved, but manufacturing cost increases and adaptability decreases
Solution Approach 1:
The conductive shield is segmented into two separate components: the shield body and the grounding contacts. This allows the shield to be designed for specific EMI shielding requirements while the grounding contacts can be customized for different applications and PCB configurations, thereby improving adaptability without compromising shielding effectiveness.
Solution Approach 2:
The grounding contacts are designed as separate, interchangeable components that can be adapted to various PCB types and configurations. This universal approach allows the same shield design to be used across multiple applications by simply changing the grounding contacts, enhancing versatility while maintaining EMI protection.
2Object-affected harmful factors
If a conductive shield is designed for particular applications with integrated terminals, then EMI shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
By separating the shield body from the grounding contacts, each component can be manufactured independently using optimized processes. This segmentation allows for more efficient production, reduced material waste, and easier assembly, thereby lowering manufacturing costs while maintaining effective EMI shielding.
Solution Approach 2:
The grounding contacts are designed to self-align and self-secure into the PCB through compliant pins and wall-engaging segments. This self-service feature eliminates complex assembly operations and reduces manufacturing steps, contributing to cost reduction while ensuring proper electrical connection for EMI shielding.
3Reliability
If grounding contacts are distributed along the perimeter line, then electrical coupling effectiveness is improved, but device complexity increases
Solution Approach 1:
Multiple grounding contacts are merged into a single continuous perimeter line configuration. This merging approach maintains effective electrical coupling across the shield by distributing contacts along the perimeter, while simplifying the overall design and reducing the number of discrete components that would otherwise be required.
Solution Approach 2:
The grounding contacts distributed along the perimeter line create an equipotential boundary that effectively grounds the entire shield. This configuration ensures uniform electrical coupling without requiring complex internal grounding structures, thereby maintaining reliability while avoiding excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces EMI leakage and susceptibility while being more economical and versatile, allowing for various applications without negatively impacting the performance of electronic components.
Implementation Method 1
The pin segments include compliant pins that are insertable into the thru-holes... The grounding contacts are distributed along the perimeter line and electrically couple the conductive shield to the ground conductor of the printed circuit
Implementation Method 2
The wall-engaging segments are connected to respective sidewalls... The first and second arms are sized and shaped to receive a thickness of the respective sidewall such that the first and second arms engage opposite wall surfaces of the sidewall
Implementation Method 3
an electronic component may be protected by a conductive shield... The conductive shield is designed to electrically couple to a ground conductor of the printed circuit... effectively reduces EMI leakage and susceptibility
Data Source
AI summary
Electronic assembly includes a printed circuit having a plurality of thru-holes. The electronic assembly also includes a conductive shield having a plurality of sidewalls. The sidewalls define a cavity. Edges of at least some of the sidewalls interface with the printed circuit along a perimeter line. The perimeter line intersects the thru-holes or extends immediately adjacent to the thru-holes. The electronic assembly also includes a plurality of grounding contacts that are each discrete with respect to the conductive shield. Each of the grounding contacts of said plurality includes a pin segment and a wall-engaging segment. The pin segments include compliant pins that are insertable into the thru-holes. The wall-engaging segments are connected to respective sidewalls. The grounding contacts are distributed along the perimeter line and electrically couple the conductive shield to the ground conductor of the printed circuit.