Shield Interconnect Packaging for Compact EMI-Protected Semiconductors

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Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.

Innovation Solution

The implementation of a semiconductor structure with a conductive structure having a shielding terminal, an electronic component, a package body, and a shield interconnect that connects the shield to the terminal, enhancing electromagnetic interference (EMI) shielding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing cost is reduced, but EMI shielding efficiency decreases and reliability decreases

Engineering Contradiction:

ImproveEMI shielding efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The shield interconnect is nested within the package body structure, with the shield layer positioned between the package body and the substrate. This nested configuration provides EMI shielding without requiring separate external shielding components, thereby improving shielding efficiency while maintaining manufacturing simplicity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The package body serves multiple functions: it provides mechanical support, electrical connection, and EMI shielding. The shield interconnect integrated into the package body structure eliminates the need for separate shielding components, reducing manufacturing complexity while enhancing shielding performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If shield layers are exposed, then EMI shielding efficiency increases, but oxidation and corrosion increase

Engineering Contradiction:

ImproveEMI shielding efficiencyVSAvoidoxidation and corrosion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A conformal dielectric layer is deposited over the shield interconnect, forming a protective thin film that prevents oxidation and corrosion of the shield layer. This dielectric coating maintains the shielding effectiveness while protecting the conductive material from environmental degradation.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The dielectric layer creates an inert environment around the shield interconnect, isolating it from oxygen and moisture that cause oxidation and corrosion. This protective barrier ensures long-term reliability of the shielding structure.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

3Reliability

If package size is reduced, then performance improves, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shield interconnect is merged with the package body structure, eliminating the need for separate shielding components. This integration reduces the overall package size while maintaining effective EMI shielding, and simplifies manufacturing by reducing the number of assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shielding function is implemented in the vertical dimension within the package body, rather than requiring lateral expansion. The shield layer is positioned between the package body and substrate in the vertical direction, providing effective shielding without increasing package footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12519065B2Semiconductor devices comprising interconnect terminal with concave recess exposed from dielectric structure at lateral and bottom side of the substrate and methods of manufacturing semiconductor devices

Publication Date: 2026.01.06 AMKOR TECH JAPAN INC

AI summary

In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.