Shield Interposer for Stacked Semiconductor Noise Isolation
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Solution Overview
Problem
The reduction in size of semiconductor packages and increased proximity of multiple dies lead to significant electromagnetic noise interference, causing undesired noise currents and voltages between dies, which impairs functionality.
Innovation Solution
A shield interposer is introduced between active dies, featuring electromagnetic shields connected to fixed potentials through TSVs, which redirects and terminates electromagnetic fields, thereby reducing noise coupling and providing decoupling capacitance for improved power integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor dies are placed in close proximity to reduce package size, then package functionality is increased, but electromagnetic noise interference between dies increases
Solution Approach 1:
A shield interposer is introduced as an intermediary component between adjacent semiconductor dies. The shield interposer includes a substrate with conductive shielding structures (such as ground planes or conductive vias) that act as a mediator to block and redirect electromagnetic fields, preventing noise coupling between dies while allowing the package to maintain high functionality with multiple dies in close proximity.
Solution Approach 2:
The package structure is segmented by inserting a shield interposer between adjacent dies, dividing the package into isolated electromagnetic zones. This segmentation creates physical and electromagnetic separation, allowing each die to operate independently without interfering with others, thus enabling higher package functionality without increased noise interference.
2Productivity
If package size is reduced to accommodate more dies, then functionality increases, but separation between adjacent dies decreases leading to increased noise coupling
Solution Approach 1:
Instead of increasing horizontal separation between dies (which would increase package footprint), the solution moves to the vertical dimension by stacking the shield interposer between dies. The shielding structures extend through the thickness of the interposer, providing electromagnetic isolation in the vertical direction while maintaining close horizontal proximity of dies, thus accommodating more dies per package without increasing noise coupling.
Solution Approach 2:
The shield interposer serves as a mediating structure that fills the space between adjacent dies, providing electromagnetic shielding without requiring increased physical separation. The conductive shielding elements within the interposer actively manage the electromagnetic fields in the reduced separation space, enabling high die density while controlling noise coupling.
3Productivity
If complex dies with numerous transistors and multi-level interconnects are used, then functionality increases, but transient currents and electromagnetic noise generation increase
Solution Approach 1:
The shield interposer converts the harmful electromagnetic noise generated by complex dies into a manageable phenomenon. The conductive shielding structures capture and redirect the electromagnetic fields produced by transient currents in the dies, channeling the energy into controlled paths (such as ground connections) where it can be dissipated safely, thus allowing high-functionality complex dies to coexist without excessive noise interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield interposer effectively minimizes electromagnetic noise between stacked dies, enhancing signal integrity and reducing crosstalk, while also offering benefits in power decoupling capacitance.
Implementation Method 1
a substrate having a shielding channel through a substrate first side and a substrate second side with the shielding channel grounded at the substrate second side
Implementation Method 2
electromagnetic noise from one die has a great undesired impact in other dies in the package. More specifically, electromagnetic noise generated by one die typically induces undesired noise currents and noise voltages in the other dies
Implementation Method 3
A plurality of through-silicon vias (TSVs) within a first plane thereof adapted to serve as power, ground and signal interconnections throughout the first plane
Implementation Method 4
providing decoupling capacitance for improved power integrity
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
There are disclosed herein various implementations of a shield interposer situated between a top active die and a bottom active die for shielding the active dies from electromagnetic noise. One implementation includes an interposer dielectric layer, a through-silicon via (TSV) within the interposer dielectric layer, and an electromagnetic shield. The TSV connects the electromagnetic shield to a first fixed potential. The electromagnetic shield may include a grid of conductive layers laterally extending across the shield interposer. The shield interposer may also include another electromagnetic shield connected to another fixed potential.