Shield Layer Slits for Circuit Module Noise Isolation
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Solution Overview
Problem
Existing circuit modules face challenges in effectively isolating electronic components from noise radiation and ingress due to the roundabout path of noise through the shield layer, which compromises the isolation characteristics between components.
Innovation Solution
A circuit module design featuring a circuit board with a ground layer, conductor posts, and a shield layer with slits, where the conductor posts are arranged to traverse between noise-generating and noise-sensitive components, and the shield layer is formed with slits that pass between the conductor posts and components, reducing noise roundabout and enhancing isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the shield layer covers the main surface of the insulator layer and the inner peripheral surface of the recess portion, then radiation of noise to an outside and ingress of noise from the outside are suppressed, but noise generated in electronic components may take a roundabout route to another electronic component via the shield layer
Solution Approach 1:
The shield layer is divided into multiple independent shield regions, each corresponding to a specific electronic component. These shield regions are electrically isolated from each other by insulating structures (mold resin portions), preventing noise from propagating through the shield layer while maintaining effective noise suppression for each component.
Solution Approach 2:
Each shield region is specifically positioned and shaped to provide localized noise shielding for its corresponding electronic component. The shield layers have different configurations and positions tailored to the specific noise characteristics and locations of different components, rather than using a uniform continuous shield structure.
2Object-affected harmful factors
If a continuous shield layer is used to suppress noise radiation and ingress, then isolation from external noise is improved, but isolation characteristics between electronic components deteriorate due to noise roundabout
Solution Approach 1:
The continuous shield layer is segmented into multiple independent shield regions that are electrically isolated from each other. This segmentation prevents noise from traveling through the shield layer between components while maintaining effective shielding against external noise for each component area.
Solution Approach 2:
Insulating structures (mold resin portions) are introduced as intermediary elements between adjacent shield regions. These intermediaries electrically isolate the shield regions from each other, blocking noise propagation paths through the shield layer while allowing each shield region to independently perform its noise suppression function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses noise radiation and ingress, improving isolation characteristics between electronic components by reducing noise roundabout through the shield layer, while maintaining effective noise shielding.
Implementation Method 1
The shield layer has a slit. The shield layer is formed on a surface on a side of the mold layer opposite to the mounting surface. The slit, with respect to each conductor post included in the group of the conductor posts, in a plan view, passes and extends between the conductor post and the first electronic component, or between the conductor post and the second electronic component.
Implementation Method 2
The plurality of conductor posts includes a group of conductor posts arranged so as to traverse between the first electronic component and the second electronic component on the mounting surface and electrically connected to the ground layer.
Data Source
AI summary
A circuit module (100) includes an electronic component (30), a plurality of conductor posts (40), a mold layer (50) that seals a plurality of the electronic components (30) and the plurality of conductor posts (40), and a shield layer (60) on the mold layer (50). The electronic components (30) include a first electronic component (31) and second electronic components (32, 36). The plurality of conductor posts (40) includes a group of conductor posts (400) traversing between the first electronic component (31) and the second electronic components (32, 36). The shield layer (60) includes a slit (600) that, with respect to each conductor post (40) included in the group (400) of conductor posts, in a plan view, passes and extends between the conductor post (40) and the first electronic component (31), or between the conductor post (40) and the second electronic components (32, 36).