Shielding Magnetic Force Lines in Solid-State Image Sensors
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Solution Overview
Problem
Solid-state imaging devices experience property degradation due to magnetic force lines generated from wiring within the package, which existing electromagnetic shielding technologies fail to adequately prevent.
Innovation Solution
Incorporating a shield, either made of magnetic material or conductor like copper or iron, housed within a recessed package with a seal glass to intercept and counteract magnetic force lines, thereby protecting the solid-state image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductor is arranged at the outer periphery of the package, then electromagnetic shielding properties are improved, but magnetic force lines from internal wiring still reach the solid-state image sensor causing property degradation
Solution Approach 1:
A shield made of magnetic material is introduced as an intermediary component between the wiring and the solid-state image sensor. This shield acts as a mediator that attracts and redirects magnetic force lines away from the sensor, preventing direct interaction between the harmful magnetic fields generated by wiring and the sensitive imaging elements.
Solution Approach 2:
The harmful magnetic field effect is extracted and isolated from the sensor by placing a dedicated shield component. The shield separates the magnetic field interaction from the sensor, allowing the conductor to remain at the outer periphery for electromagnetic shielding while the shield handles the internal magnetic force line management.
2Power
If high current flows through the solid-state imaging device, then imaging performance is improved, but magnetic force lines generated from wiring increase causing sensor degradation
Solution Approach 1:
The magnetic material shield converts the harmful magnetic force lines generated by high-current wiring into a beneficial shielding effect. The shield actively attracts and redirects these magnetic force lines, transforming the harmful byproduct of high-power operation into a controlled magnetic field distribution that protects the sensor.
3Device complexity
If wiring is arranged inside the package, then device integration is improved, but magnetic force lines from wiring directly reach the solid-state image sensor
Solution Approach 1:
The internal space of the package is segmented into different functional zones: a wiring area for electrical connections and a sensor area for imaging. The shield acts as a boundary element that divides these zones, allowing wiring to be integrated inside the package while preventing magnetic field interference from reaching the sensor area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents degradation of solid-state image sensor properties by diverting magnetic force lines away from the sensor, enhancing device reliability and design flexibility while improving manufacturing productivity.
Implementation Method 1
The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.
Implementation Method 2
The shield may be formed of a magnetic material. Since the shield is formed of the magnetic material, the shield can draw the magnetic force lines generated from the wiring and prevent the magnetic force lines from arriving at the solid-state image sensor.
Data Source
AI summary
[Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.