Integrated Shield Module Layout for Low-Cost EMI Reduction
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Solution Overview
Problem
As electronic components become smaller and faster, they generate electromagnetic emissions that can interfere with other components, posing challenges in electromagnetic compatibility (EMC), and existing shielding solutions are difficult to implement without increasing the module's size or costing too much.
Innovation Solution
An integrated module with electromagnetic shielding is developed, featuring a module substrate with perimeter and interior bond pads, vertical shield contacts, and a shielding structure that covers the top and side surfaces without covering the bottom, using materials like copper, aluminum, or gold for the first layer and nickel for the second layer, to effectively reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive shield is added to cover the top and side surfaces of the integrated module, then electromagnetic interference is reduced, but the manufacturing cost increases
Solution Approach 1:
The shield structure is merged with the module substrate by forming conductive shield contacts that extend through the mold compound and bond to ground bond pads on the substrate. This integration eliminates the need for separate shield components and reduces overall manufacturing complexity and cost.
Solution Approach 2:
Ground bond pads are pre-formed on the module substrate before encapsulation, and shield contacts are designed to bond to these pre-existing ground points. This preliminary preparation simplifies the subsequent shielding implementation and reduces manufacturing steps.
2Object-affected harmful factors
If a conductive shield is added to cover the top and side surfaces of the integrated module, then electromagnetic interference is reduced, but the device complexity increases
Solution Approach 1:
The shield is merged with existing module components (substrate, mold compound, and ground connections) rather than adding completely separate elements. The shield contacts utilize the existing ground bond pad infrastructure, reducing overall structural complexity.
3Object-affected harmful factors
If the shield covers all surfaces including bottom surface, then electromagnetic shielding is improved, but the size of the integrated module increases
Solution Approach 1:
The shield is applied selectively to only those surfaces (top and side surfaces) that require electromagnetic protection based on the actual emission and susceptibility patterns of the electronic components. The bottom surface is excluded from shielding, optimizing the balance between protection and compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective electromagnetic shielding that reduces electromagnetic interference without increasing the module's size or incurring high manufacturing costs, ensuring compatibility and reliability in compact electronic devices.
Implementation Method 1
the shield is formed from a conductive material that covers the top and at least a portion of the side of one circuit module. When electromagnetic emissions from the circuit module strike the interior surface of the conductive material, the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions.
Implementation Method 2
the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions
Data Source
AI summary
The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure. The perimeter bond pads are surrounding the at least one electronic component and encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound, such that a top tip of each perimeter vertical shield contact is exposed at a top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.