Semiconductor Package Shield-Molding Structure for EMI Containment
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Solution Overview
Problem
Electromagnetic waves emitted from semiconductor packages can interfere with adjacent devices, causing noise and malfunction, and existing solutions are costly and inefficient in effectively shielding these waves.
Innovation Solution
A semiconductor package design that includes an electromagnetic shield member with a thickness of 1.5 μm or greater, electrically connected to a conductive member on the package substrate, which covers the semiconductor chip and is integrated with a molding member to absorb and direct electromagnetic waves to a ground circuit, reducing interference and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic shield is installed on semiconductor packages to prevent electromagnetic wave emission, then electromagnetic interference with adjacent devices is reduced, but manufacturing cost increases
Solution Approach 1:
The electromagnetic shield member is merged with the molding member to form an integrated structure. The shield member is formed as an integral part of the molding compound that encapsulates the semiconductor chip, eliminating the need for separate shield installation steps and reducing overall manufacturing cost while maintaining effective electromagnetic shielding coverage around the chip.
Solution Approach 2:
The molding member serves dual functions: it provides mechanical encapsulation and protection for the semiconductor chip, and simultaneously acts as an electromagnetic shield when formulated with conductive materials or structures. This multi-functionality reduces the need for additional dedicated shielding components and processes.
2Object-affected harmful factors
If a thick electromagnetic shield member is used to effectively block electromagnetic waves, then shielding effectiveness is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The electromagnetic shield is implemented as a thin film or layer integrated within the molding compound rather than a thick rigid structure. By incorporating conductive particles, fibers, or coatings into the molding material, effective electromagnetic shielding is achieved with minimal thickness, reducing device complexity and allowing easy integration with the chip packaging process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields electromagnetic waves, preventing interference with adjacent devices and reducing manufacturing costs by integrating the electromagnetic shield member at the wafer level, resulting in a more efficient and cost-effective semiconductor package.
Implementation Method 1
an electromagnetic shield member configured to effectively shield electromagnetic waves
Data Source
AI summary
Disclosed are semiconductor packages and methods of fabricating the same. The method includes forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. The electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.