Shield Structure With Openings And Conductive Tape
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Solution Overview
Problem
Conventional shield structures formed by metal punching are prone to deformation and weight issues, leading to poor shielding effects, space compression, and heat dissipation problems when assembled and disassembled.
Innovation Solution
A shield structure featuring a shield bracket, a shield cover with openings, and a thin conductive shield layer (copper foil, aluminum foil, or FPC) spliced with the cover using a conductive tape, where the opening area accounts for over 50% of the cover's area, allowing for reduced weight and effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal punched shield cover is used, then the shielding effect is ensured, but the weight increases and space is compressed
Solution Approach 1:
The patent replaces the traditional thick metal punched shield cover with a thin film shield cover having a thickness of 0.03-0.15mm. This thin film structure maintains the shielding effect while dramatically reducing the weight and space occupation of the shield assembly.
Solution Approach 2:
The patent uses composite material construction where the thin film shield cover is combined with conductive adhesive tape and conductive foam material to achieve the required shielding performance without relying solely on thick metal, thus reducing overall weight.
2Reliability
If a metal punched shield cover is used, then the shielding effect is ensured, but heat dissipation is poor causing temperature rise
Solution Approach 1:
The thin film shield cover with thickness of 0.03-0.15mm provides better thermal conduction compared to thick metal structures, enabling more effective heat dissipation while maintaining shielding performance.
Solution Approach 2:
The patent changes the thickness parameter of the shield cover from traditional thick metal to thin film dimensions, which fundamentally alters the thermal conduction characteristics and improves heat dissipation capability.
3Strength
If a metal punched shield cover is used, then the structural strength is ensured, but deformation occurs after repeated assembly and disassembly
Solution Approach 1:
The thin film shield cover is designed with appropriate flexibility to accommodate assembly and disassembly operations without permanent deformation, while the conductive adhesive tape and foam material provide structural support.
Solution Approach 2:
The composite structure of thin film cover combined with conductive adhesive tape and foam material distributes mechanical stresses, preventing deformation of the cover itself during repeated assembly cycles.
4Weight of moving object
If a thin shield layer is used, then the weight is reduced and heat dissipation is improved, but the shielding effect may be compromised
Solution Approach 1:
The patent employs composite materials where the thin film shield cover (0.03-0.15mm thick) is combined with conductive adhesive tape and conductive foam material. This composite structure achieves the required shielding effect while maintaining the weight and heat dissipation benefits of the thin film design.
Solution Approach 2:
The patent merges multiple components (thin film cover, conductive adhesive tape, conductive foam material) into an integrated shield structure that collectively provides the shielding effect, compensating for the reduced thickness of individual components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the weight and size of the shield while maintaining shielding effectiveness, facilitating assembly and repair, and enhancing heat dissipation without compromising the shielding performance.
Implementation Method 1
The shield layer is spliced with the shield cover through a conductive tape layer
Implementation Method 2
the shield layer is thin, capable of lowering down the shield, dissipating heat effectively, reducing the temperature of the whole machine
Data Source
AI summary
A shield structure includes a shield bracket, a shield cover, and a shield layer. The shield cover is formed with openings. The shield layer is spliced with the shield cover through a conductive tape layer and covers all openings. The shield cover is formed with openings and a light shield layer is spliced with the shield cover and covers the openings, greatly reducing the weight of the shield cover while ensuring the shielding effect, without compressing space for other elements. The shield layer is thin, capable of lowering down the shield, dissipating heat effectively, reducing the temperature of the whole machine and providing a good environment for the operation of the whole machine, without affecting the shielding effect; and the conductive tape layer is spliced with the shield layer, thus allowing multiple assembling without damaging the whole structure, and facilitating subsequent repair.