Shield Package Laser-Etched Resin Pattern

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Solution Overview

Problem

Conventional shield packages with laser-marked resin layers and sputtered metal thin films suffer from poor reliability in heat cycle tests and low productivity due to differences in linear expansion coefficients and high costs of sputtering devices, while conductive coating materials obscure the distinctive patterns formed on the shield layers.

Innovation Solution

A shield package with a resin layer featuring a drawing area of aggregated grooves formed by laser etching, creating a pattern with lines and/or dots on the surface, which results in a highly distinctive and machine-readable design, using a conductive coating material to form depressions that enhance reflectance differences and pattern clarity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a metal thin film is deposited by sputtering to form a shield layer, then a distinctive pattern is formed with clear boundaries, but the reliability in heat cycle test deteriorates due to different linear expansion coefficients between resin layer and metal thin film

Engineering Contradiction:

Improvepattern boundary distinctivenessVSAvoidheat cycle test reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces the expensive sputtering process with a simpler, more cost-effective conductive coating material application method. The conductive coating material is applied to the laser-etched resin layer to form a shield layer that maintains pattern distinctiveness while avoiding the reliability issues of metal thin films deposited by sputtering.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameters by using conductive coating material instead of metal thin film, and adjusts the laser etching parameters (groove interval 10-100 μm, depth 5 μm or more) to optimize the pattern formation while ensuring reliability under heat cycle conditions.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If sputtering is used to form a shield layer, then a distinctive pattern is achieved, but productivity deteriorates due to high cost of sputtering devices

Engineering Contradiction:

Improvepattern distinctivenessVSAvoidmanufacturing cost and efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the expensive sputtering process with a simpler, more cost-effective conductive coating material application method, significantly reducing equipment cost and improving manufacturing productivity while maintaining pattern distinctiveness.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent substitutes the complex sputtering mechanical system with a simpler conductive coating material application process, replacing high-vacuum deposition equipment with more accessible and cost-effective coating methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If conductive coating material is sprayed to form a shield layer, then productivity is improved, but the pattern boundary becomes unclear due to leveling effect smoothing the surface

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidpattern boundary clarity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent optimizes the laser etching parameters (groove interval 10-100 μm, depth 5 μm or more) to create sufficient surface irregularities that maintain pattern boundary clarity even after conductive coating material is applied and levels the surface slightly.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent performs laser etching to create grooves on the resin layer surface before applying the conductive coating material, ensuring that the pattern structure is established in advance and will remain visible despite the leveling effect of the coating process.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a highly distinctive pattern with clear boundaries, improving readability by machines and maintaining reliability and productivity through controlled groove dimensions and material usage.

Implementation Method 1

a laser beam is applied to a resin layer of a package to etch a surface of the resin layer, whereby a groove is formed

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

a metal thin film is deposited on the resin layer by sputtering to form a shield layer

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS11510349B2Shield package and method of manufacturing shield package

Publication Date: 2022.11.22 TATSUTA ELECTRICWIRE & CABLE

AI summary

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.