Substrate Temperature Measurement Shield Plate Contamination Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In rapid thermal processing (RTP) apparatuses, temperature measurement deviations occur due to contamination of the temperature measurement part by process by-products, leading to decreased precision and potential damage, requiring frequent replacement of shield plates, which increases costs and downtime.
Innovation Solution
An apparatus with a light-transmitting shield plate and a contamination level measurement system that adjusts the temperature calculation by reflecting the contamination level of the shield plate, using the relationship between reflected light quantity and emissivity to compensate for deviations, allowing for extended shield plate replacement cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield plate is disposed between the edge ring and the temperature measurement part to prevent contamination, then the temperature measurement part is protected from contaminants, but the contaminants accumulate on the shield plate causing temperature measurement deviation
Solution Approach 1:
The system measures the reflection quantity of light from the shield plate and uses this feedback to calculate the contamination level. Based on this contamination level information, the system resets the relationship between reflected light quantity and emissivity, thereby compensating for the temperature measurement deviation caused by contamination and maintaining accurate temperature measurements throughout the shield plate's service life
Solution Approach 2:
The system changes the parameters used for temperature calculation by resetting the relationship between reflected light quantity and emissivity based on the measured contamination level. This parameter adjustment allows the system to maintain temperature measurement accuracy despite the presence of contaminants on the shield plate
2Measurement precision
If the shield plate is frequently replaced to maintain temperature measurement precision, then the temperature measurement precision is maintained, but the process costs increase and apparatus downtime increases
Solution Approach 1:
Instead of replacing the shield plate based on fixed schedules, the system continuously monitors the contamination level through light reflection measurements and dynamically adjusts temperature calculations. This feedback mechanism allows the shield plate to remain in service much longer while maintaining temperature measurement precision, thereby reducing replacement frequency and improving apparatus availability
Solution Approach 2:
The system performs self-correction by automatically detecting contamination levels and resetting the emissivity relationship parameters without requiring manual intervention or shield plate replacement. This self-service capability extends the operational life of the shield plate while maintaining measurement accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes temperature measurement deviations and extends the replacement cycle of the shield plate, reducing process costs and improving productivity by maintaining accurate temperature measurements even with contaminated shield plates.
Implementation Method 1
a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source
Implementation Method 2
a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate
Data Source
AI summary
Provided are an apparatus for processing a substrate and a method for measuring a temperature of the substrate. The apparatus for processing the substrate includes a temperature measurement part and a light-transmitting shield plate. The temperature measurement part includes a light source, a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate to measure a quantity of the reflected light and an intensity of the radiant light and a temperature calculation part configured to calculate the temperature of the substrate, to which a contamination level of the shield plate is reflected, by using the quantity of the reflected light and the intensity of the radiant light.