High-Frequency Module Shield Plate Layout for EMI Coupling
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Solution Overview
Problem
In high-frequency modules used in mobile communication devices, electromagnetic field coupling between circuit components can lead to degradation of transmission signal quality and reduction in reception sensitivity due to harmonic interference and intermodulation distortion.
Innovation Solution
A high-frequency module design that includes a module substrate with circuit components, a resin member covering these components, a metallic layer set to ground potential, and a metallic plate between the circuit components, which suppresses electromagnetic field coupling and enhances signal quality while maintaining high visibility of engraved marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If circuit components are arranged closely on the module substrate to achieve miniaturization, then the module size is reduced, but electromagnetic field coupling between components increases causing signal quality degradation
Solution Approach 1:
A resin member is introduced as an intermediary substance between circuit components on the module substrate. This resin member has electromagnetic shielding properties that prevent harmful electromagnetic field coupling between adjacent components while allowing the components to remain in close proximity for miniaturization. The resin member acts as a mediator that enables both compact arrangement and signal isolation.
Solution Approach 2:
The resin member is selectively applied in specific regions between circuit components rather than uniformly across the entire substrate. This local application provides electromagnetic shielding precisely where needed between adjacent components, while maintaining other desirable properties of the substrate elsewhere. The local quality approach enables targeted suppression of electromagnetic coupling without compromising overall module performance.
2Object-affected harmful factors
If a metallic shield plate is added to suppress electromagnetic field coupling, then signal quality is improved, but the visibility of engraved marks on the module surface is reduced
Solution Approach 1:
The resin member is selected with specific optical properties including color and transparency that enhance the visibility of engraved marks on the module surface. By carefully choosing the resin's optical characteristics, engraved marks remain highly visible despite the presence of electromagnetic shielding materials. The resin's optical properties are optimized to work harmoniously with the marking system while providing necessary electromagnetic protection.
Solution Approach 2:
The resin member functions as a composite material that simultaneously provides electromagnetic shielding properties and optical transparency appropriate for mark visibility. This composite material integrates multiple functions: it shields against electromagnetic interference between components while allowing engraved marks to remain visible on the module surface. The composite nature enables both signal quality improvement and aesthetic maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the deterioration of transmission and reception signal quality and ensures high visibility of engraved marks, even in miniaturized high-frequency modules.
Implementation Method 1
a metallic plate arranged on the main surface and between the first circuit component and the second circuit component when the main surface is viewed in a plan view and set to the ground potential, in which the metallic plate is in contact with the metallic layer
Data Source
AI summary
A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member. At least a part of the engraved mark portion is provided in a portion in which the resin member and the metallic shield plate overlap each other when the main surface is viewed in a plan view.