Shield Structure Using Conductive Protrusions
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Solution Overview
Problem
Existing electrical shield structures for machine tool control panels are costly due to the use of conductive packings and often compromise physical sealability when using insulating materials instead.
Innovation Solution
An electrical shield structure that uses a metal frame with conductivity protrusions surrounding electronic components, which are inserted through holes in a general packing, allowing both physical sealability and electrical shielding without the need for expensive conductive packings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive packing is used for electrical shielding, then electrical shielding effect is improved, but cost increases
Solution Approach 1:
The patent replaces expensive conductive packing with a combination of general insulating packing and simple conductive protrusions (embossed portions) that can be easily formed on the metal frame. This substitution uses cheaper, easier-to-manufacture components while achieving the same electrical shielding function.
Solution Approach 2:
The patent divides the electrical shielding function into two separate components: the insulating packing material and the conductive protrusions on the metal frame. This segmentation allows each component to be optimized independently - the packing provides sealing and insulation, while the protrusions provide the electrical conductivity path to ground, reducing overall cost.
2Ease of manufacture
If insulating packing is used instead of conductive packing, then cost is reduced, but electrical shielding effect deteriorates
Solution Approach 1:
The conductive protrusions act as an intermediary element that bridges the insulating packing and the ground potential. The protrusions penetrate through the insulating packing to establish an electrical connection, thereby enabling electrical shielding while allowing the use of cheaper insulating packing material.
Solution Approach 2:
The patent applies local conductivity only where needed - the conductive protrusions are positioned specifically at the periphery of the electronic component to provide electrical shielding, while the rest of the packing can remain insulating and cheaper. This localized approach to conductivity reduces overall cost while maintaining shielding effectiveness.
3Reliability
If seal member is used for physical sealing, then physical sealability is improved, but electrical shielding effect deteriorates
Solution Approach 1:
The patent merges the sealing function and the electrical shielding function into a single integrated structure. The general packing provides physical sealing, while the conductive protrusions on the metal frame provide electrical shielding. Both functions are achieved simultaneously through the combination of these two simple components, eliminating the need for expensive multi-functional conductive packing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides effective physical sealing and electrical shielding at a reduced cost by using a general packing, ensuring the protection of electronic components from cutting fluids and electromagnetic interference.
Implementation Method 1
a structure in which a seal member such as a packing is used between the control panel housing and the electronic device unit so as not to allow outside air or the cutting fluid to infiltrate into the control panel housing
Implementation Method 2
the metal frame 4 and the control panel housing 2 come into contact with each other via the conductive packing 10, and thus an electrical shield which electrically shields an electronic component from an outside factory environment is formed
Data Source
AI summary
In an electrical shield structure of an electronic device unit and a control panel housing, a metal frame includes a plurality of protrusions having conductivity and having heights to come into contact with the control panel housing. The plurality of protrusions are provided at positions which surround an electronic component. A packing includes a plurality of holes through which the protrusions are inserted at positions corresponding to the positions of the protrusions.


