Shield Structure Segmentation for High-Frequency Module Reliability
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Solution Overview
Problem
The existing high frequency module manufacturing process is complex and prone to defects, leading to a high defect rate and increased costs due to the incorporation of expensive ICs in defective products.
Innovation Solution
A module design featuring a shield structure with a conductive and magnetic layer, where the shield structure is pre-inspected as a separate component to ensure non-defectiveness, and is electrically connected to a ground conductor, covering the sealing resin and wiring board surfaces to reduce interference and internal component interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complicated multi-step process is used to assemble the module (mounting shield component, forming sealing resin layer, forming recess, forming magnetic film, forming shield film), then the module can achieve complete shielding and sealing, but the defect rate increases because any one step can be defective
Solution Approach 1:
The shield structure is divided into separate functional components: a shield component with conductive properties and a magnetic film with magnetic properties. These are mounted separately on the wiring board before assembly, allowing independent inspection and quality control of each component before final assembly, thereby reducing the overall defect rate while maintaining complete shielding functionality.
Solution Approach 2:
The shield component and magnetic film are prepared and inspected as separate components before being assembled into the final module. This preliminary inspection allows defective components to be identified and rejected before assembly, preventing defects from propagating through the entire module and reducing the defect rate of finished products.
2Reliability
If a complicated multi-step process is used to assemble the module, then complete shielding can be achieved, but the manufacturing cost increases due to higher complexity and potential waste of expensive ICs
Solution Approach 1:
By segmenting the shield function into separate components (shield component and magnetic film) that can be prepared and inspected independently, the manufacturing process becomes more controllable. This segmentation allows for better quality management and reduces the complexity of tracking defects through multiple sequential steps, ultimately lowering manufacturing costs despite maintaining complete shielding.
Solution Approach 2:
Preparing and inspecting shield components before assembly allows for early detection and rejection of defective parts. This prevents waste of expensive ICs and other components that would occur if defects were discovered only after assembly, thereby reducing manufacturing costs while maintaining shielding completeness.
3Manufacturing precision
If the shield structure is prepared as a separate inspected component, then the defect rate can be suppressed, but the assembly process requires additional steps for integrating the shield structure with components
Solution Approach 1:
The shield structure is segmented into separate components (shield component and magnetic film) that can be manufactured and inspected independently. This segmentation, while adding initial preparation steps, actually simplifies the overall manufacturing process by allowing parallel production and inspection of components before final assembly, rather than requiring sequential inspection of every assembly step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the defect rate and associated costs by using only non-defective shield structures, minimizing waste of expensive components like ICs, and effectively shielding against external and internal interference.
Implementation Method 1
the conductive layer at the sidewall portion being electrically connected to the ground conductor between the first component and the second component
Implementation Method 2
the magnetic layer at the top side portion being located over the first component
Implementation Method 3
the shield film being electrically connected to the ground conductor
Data Source
AI summary
A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.